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TL052AIP Datasheet(Fiches technique) 5 Page - Texas Instruments

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Numéro de pièce TL052AIP
Description  ENHANCED-JFET LOW-OFFSET OPERATIONAL AMPLIFIERS
Télécharger  65 Pages
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Fabricant  TI [Texas Instruments]
Site Internet  http://www.ti.com
Logo TI - Texas Instruments

TL052AIP Datasheet(HTML) 5 Page - Texas Instruments

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TL05x, TL05xA, TL05xY
ENHANCED-JFET LOW-OFFSET
OPERATIONAL AMPLIFIERS
SLOS178 – FEBRUARY 1997
5
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
TL052Y chip information
This chip, when properly assembled, displays characteristics similar to the TL052. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 15 MILS TYPICAL
BONDING PADS: 4
× 4 MILS MINIMUM
TJmax = 150°C
TOLERANCES ARE
±10%.
ALL DIMENSIONS ARE IN MILS.
PIN (4) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
+
1OUT
1IN +
1IN –
VCC+
(8)
(6)
(3)
(2)
(5)
(1)
+
(7)
2IN +
2IN –
2OUT
(4)
VCC –
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
66
72


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