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TL052ACP Datasheet(Fiches technique) 6 Page - Texas Instruments

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Numéro de pièce TL052ACP
Description  ENHANCED-JFET LOW-OFFSET OPERATIONAL AMPLIFIERS
Télécharger  65 Pages
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Fabricant  TI [Texas Instruments]
Site Internet  http://www.ti.com
Logo TI - Texas Instruments

TL052ACP Datasheet(HTML) 6 Page - Texas Instruments

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TL05x, TL05xA, TL05xY
ENHANCED-JFET LOW-OFFSET
OPERATIONAL AMPLIFIERS
SLOS178 – FEBRUARY 1997
6
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
TL054 chip information
This chip, when properly assembled, displays characteristics similar to the TL054C. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. These chips may be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
+
1OUT
1IN +
1IN –
VCC+
(4)
(6)
(3)
(2)
(5)
(1)
+
(7)
2IN +
2IN –
2OUT
(11)
VCC –
+
3OUT
3IN +
3IN –
(13)
(10)
(9)
(12)
(8)
+
(14)
4OUT
4IN +
4IN –
(6)
(7)
(8)
(9)
71
122
CHIP THICKNESS: 15 MILS TYPICAL
BONDING PADS: 4
× 4 MILS MINIMUM
TJmax = 150°C
TOLERANCES ARE
±10%.
ALL DIMENSIONS ARE IN MILS.
PIN (11) IS INTERNALLY CONNECTED
TO BACKSIDE OF THE CHIP.
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
(9)
(10)
(11)
(12)
(13)
(14)


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