Moteur de recherche de fiches techniques de composants électroniques
Selected language     French  ▼

Delete All


Preview PDF Download HTML

LC03-3.3.TB Datasheet(Fiches technique) 4 Page - Semtech Corporation

Numéro de pièce LC03-3.3.TB
Description  Low Capacitance 3.3 Volt TVS for High Speed Interfaces
Télécharger  7 Pages
Scroll/Zoom Zoom In 100% Zoom Out
Fabricant  SEMTECH [Semtech Corporation]
Site Internet
Logo SEMTECH - Semtech Corporation

LC03-3.3.TB Datasheet(HTML) 4 Page - Semtech Corporation

  LC03-3.3.TB Datenblatt HTML 1Page - Semtech Corporation LC03-3.3.TB Datenblatt HTML 2Page - Semtech Corporation LC03-3.3.TB Datenblatt HTML 3Page - Semtech Corporation LC03-3.3.TB Datasheet HTML 4Page - Semtech Corporation LC03-3.3.TB Datenblatt HTML 5Page - Semtech Corporation LC03-3.3.TB Datenblatt HTML 6Page - Semtech Corporation LC03-3.3.TB Datenblatt HTML 7Page - Semtech Corporation  
Zoom Inzoom in Zoom Outzoom out
 4 / 7 page
background image
 2004 Semtech Corp.
Connection for Differential (Line-to-Line) and Com-
mon Mode Protection (Line-to-Ground)
Device Connection Options for Protection of Two
High-Speed Data Lines
The LC03-3.3 is designed to protect two high-speed
data lines (one differential pair) from transient over-
voltages which result from lightning and ESD. The
device can be configured to protect in differential (Line-
to-Line) and common (Line-to-Ground) mode. Data line
inputs/outputs are connected at pins 1 to 8, and 4 to
5 as shown. Pins 2, 3, 6, and 7 are connected to
ground. These pins should be connected directly to a
ground plane on the board for best results. The path
length is kept as short as possible to minimize parasitic
inductance. In applications where high common mode
voltages are present, differential protection is achieved
by leaving pins 2, 3, 6, and 7 not connected.
Connection for Differential Protection
Applications Information
Matte Tin Lead Finish
Matte tin has become the industry standard lead-free
replacement for SnPb lead finishes. A matte tin finish
is composed of 100% tin solder with large grains.
Since the solder volume on the leads is small com-
pared to the solder paste volume that is placed on the
land pattern of the PCB, the reflow profile will be
determined by the requirements of the solder paste.
Therefore, these devices are compatible with both
lead-free and SnPb assembly techniques. In addition,
unlike other lead-free compositions, matte tin does not
have any added alloys that can cause degradation of
the solder joint.

Html Pages

1  2  3  4  5  6  7 

Datasheet Download

Go To PDF Page

Lien URL

Privacy Policy
AllDATASHEET vous a-t-il été utile ?   [ DONATE ]  

À propos de Alldatasheet   |   Publicit   |   Contactez-nous   |   Politique de confidentialit   |   Echange de liens   |   Manufacturer List
All Rights Reserved©

Mirror Sites
English :  |   English :  |   Chinese :  |   German :  |   Japanese :
Russian :  |   Korean :  |   Spanish :  |   French :  |   Italian :
Portuguese :  |   Polish :  |   Vietnamese :