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AD5100YRQZ Fiches technique(PDF) 8 Page - Analog Devices |
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AD5100YRQZ Fiches technique(HTML) 8 Page - Analog Devices |
8 / 36 page AD5100 Rev. 0 | Page 8 of 36 ABSOLUTE MAXIMUM RATINGS Table 4. Parameter Rating V1MON to GND −0.3 V, +33 V V2MON to GND −0.3 V, +33 V V3MON to GND −0.3 V, +7 V V4MON to GND −0.3 V, +33 V VOTP to GND −0.3 V, +7 V Digital Input Voltage to GND (MR, WDI, SCL, SDA, AD0) 0 V, +7 V Digital Output Voltage to GND (RESET, V4OUT, SHDNWARN) 0 V, +7 V Digital Output Voltage to GND (SHDN) 0 V, +33 V Operating Temperature Range −40°C to +125°C Storage Temperature Range −65°C to +150°C ESD Rating (HBM) 3.5 kV Maximum Junction Temperature (TJmax) 150°C Power Dissipation1 (TJmax − TA2)/θJA Thermal Impedance3 θJA Junction-to-Ambient 105.44°C/W θJC Junction-to-Case 38.8°C/W IR Reflow Soldering (RoHS-Compliant Package) Peak Temperature 260°C (+0°C) Time at Peak Temperature 20 sec to 40 sec Ramp-Up Rate 3°C/sec max Ramp-Down Rate −6°C/sec max Time from 25°C to Peak Temperature 8 minutes max 1 Values relate to the package being used on a 4-layer board. 2 TA = ambient temperature. 3 Junction-to-case resistance is applicable to components featuring a preferential flow direction, for example, components mounted on a heat sink. Junction-to-ambient resistance is more useful for air-cooled PCB-mounted components. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ESD CAUTION |
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