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TCPT1200 Fiches technique(PDF) 5 Page - Vishay Siliconix

No de pièce TCPT1200
Description  Subminiature Transmissive Optical Sensor with Phototransistor Output, RoHS Compliant, Released for Lead (Pb)-free Solder Process
Download  9 Pages
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Fabricant  VISHAY [Vishay Siliconix]
Site Internet  http://www.vishay.com
Logo VISHAY - Vishay Siliconix

TCPT1200 Fiches technique(HTML) 5 Page - Vishay Siliconix

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TCPT1200
Document Number 83753
Rev. 1.9, 13-Mar-07
Vishay Semiconductors
www.vishay.com
5
Reflow Solder Profiles
Drypack
Devices are packed in moisture barrier bags (MBB) to
prevent the products from absorbing moisture during
transportation and storage. Each bag contains a des-
iccant.
Floor Life
Floor life (time between soldering and removing from
MBB) must not exceed the time indicated in
J-STD-020. According JEDEC, J-STD-020, this com-
ponent is released to Moisture Sensitivity Level 2, for
use of Lead Tin (SnPb) Reflow Solder Profile
(Figure 14) or Level 3, for use of Lead (Pb)-free (Sn)
Reflow Solder Profile (Figure 13).
Floor Life: 12 month (Level 2) or 168 hours (Level 3)
Floor Conditions: Tamb < 30 °C, RH < 60 %
Drying
In case of moisture absorption, devices should be
baked before soldering. Conditions see J-STD-020 or
Label. Devices taped on reel dry using recommended
conditions 192 h at 40 °C (± 5 °C), RH < 5 % or 96 h
at 60 °C (± 5 °C), RH < 5 %.
Figure 13. Lead (Pb)-free (Sn) Reflow Solder Profile
Figure 14. Lead Tin (SnPb) Reflow Solder Profile
260
280
240
220
200
180
160
140
120
100
80
260 °C
230 °C
180 °C
150 °C
Time (s)
Pre-heating time:
90 ± 30 s
Heating time:
30 ± 10 s
19152
4 °C/s MAX
4 °C/s MAX
260
280
240
220
200
180
160
140
120
100
80
240 °C
230 °C
180 °C
Pre-heating time:
90 ± 30 s
Heating time:
10 - 20 s
19153
Time (s)
150 °C
4 °C/s MAX
4 °C/s MAX


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