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TDA1170S Fiches technique(PDF) 8 Page - STMicroelectronics |
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TDA1170S Fiches technique(HTML) 8 Page - STMicroelectronics |
8 / 9 page MOUNTING INSTRUCTION The junction to ambient thermal resistance of the TDA 1170S can be reduced by soldering the tabs to a suitable copper area of the printed circuit board (fig. 4) or to an external heatsink (fig. 5). The diagram of fig. 6 shows the maximum dissipa- ble power Ptot and the Rth j-amb as a function of the side ”s” of two equal square copper areas having a thickness of 35 µ (1.4 mil). Figure 4 : Example of P.C Board Copper Are is Used as Heatsink Figure 5 : Example with External Heatsink Figure 6 : Maximum Power Dissipation and Junction-Ambient Thermal Resistance versus ”S” Figure 7 : Maximum Allowable Power Dissipation versus Ambient Temperature TDA1170S 8/9 |
Numéro de pièce similaire - TDA1170S |
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Description similaire - TDA1170S |
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