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FDD6680AS Fiches technique(PDF) 3 Page - Fairchild Semiconductor |
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FDD6680AS Fiches technique(HTML) 3 Page - Fairchild Semiconductor |
3 / 8 page FDD6680AS Rev A1 (X) D R P DS(ON) Electrical Characteristics T A = 25°C unless otherwise noted Notes: 1. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RθJC is guaranteed by design while RθCA is determined by the user's board design. a) RθJA = 40°C/W when mounted on a 1in 2 pad of 2 oz copper b) RθJA = 96°C/W when mounted on a minimum pad. Scale 1 : 1 on letter size paper 2. Pulse Test: Pulse Width < 300 µs, Duty Cycle < 2.0% 3. Maximum current is calculated as: where PD is maximum power dissipation at TC = 25°C and RDS(on) is at TJ(max) and VGS = 10V. Package current limitation is 21A |
Numéro de pièce similaire - FDD6680AS_08 |
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Description similaire - FDD6680AS_08 |
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