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ADV7441ABSTZ-5P Fiches technique(PDF) 10 Page - Analog Devices

No de pièce ADV7441ABSTZ-5P
Description  10-Bit Integrated, Multiformat SDTV/HDTV Video Decoder, RGB Graphics Digitizer, and 2:1 Multiplexed HDMI/DVI Interface
Download  28 Pages
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Fabricant  AD [Analog Devices]
Site Internet  http://www.analog.com
Logo AD - Analog Devices

ADV7441ABSTZ-5P Fiches technique(HTML) 10 Page - Analog Devices

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ADV7441A
Rev. B | Page 10 of 28
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
Table 5.
Parameter
Rating
AVDD to AGND
2.2 V
DVDD to DGND
2.2 V
PVDD to PGND
2.2 V
DVDDIO to DGND
4 V
CVDD to CGND
2.2 V
TVDD to TGND
4 V
DVDDIO to AVDD
−0.3 V to +3.6 V
DVDDIO to TVDD
−3.6 V to +3.6 V
DVDDIO to DVDD
−2 V to +2 V
CVDD to DVDD
−2 V to +0.3 V
PVDD to DVDD
−2 V to +0.3 V
AVDD to CVDD
−2 V to +2 V
AVDD to PVDD
−2 V to +2 V
AVDD to DVDD
−2 V to +0.3 V
AVDD to TVDD
−3.6 V to +0.3 V
TVDD to DVDD
−2 V to +2 V
Digital Inputs
Voltage to DGND
DGND − 0.3 V to DVDDIO + 0.3 V
Digital Outputs
Voltage to DGND
DGND − 0.3 V to DVDDIO + 0.3 V
Analog Inputs
Voltage to AGND
AGND − 0.3 V to AVDD + 0.3 V
Maximum Junction
Temperature (TJ_MAX)
125°C
Storage Temperature Range
−65°C to +150°C
Infrared Reflow,
Soldering (20 sec)
260°C
Table 6.
Package Type
ΨJT1
Unit
144-Lead LQFP (ST-144)
1.62
°C/W
1 Junction-to-package surface thermal resistance.
PACKAGE THERMAL PERFORMANCE
To reduce power consumption during ADV7441A operation,
turn off unused ADCs.
On a four-layer PCB that includes a solid ground plane, the
value of θJA is 25.3°C/W. However, due to variations within the
PCB metal and, therefore, variations in PCB heat conductivity,
the value of θJA may differ for various PCBs.
The most efficient measurement technique is to use the surface
temperature of the package to estimate the die temperature,
because this is not affected by the variance associated with the
value of θJA.
The maximum junction temperature (TJ_MAX) of 125°C must not
be exceeded. The following equation calculates the junction
temperature using the measured surface temperature of the
package and applies only when no heat sink is used on DUT:
TJ_MAX = TS + (ΨJT × WTOTAL)
where:
TS is the surface temperature of the package expressed in degrees
Celsius.
ΨJT is the junction-to-package surface thermal resistance.
WTOTAL = {(AVDD × IAVDD) + (DVDD × IDVDD) +
(DVDDIO × IDVDDIO) + (PVDD × IPVDD) +
(CVDD × ICVDD) + (TVDD × ITVDD)}.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Contact an Analog Devices, Inc., sales representative or send an
e-mail to video.products@analog.com for more information on
package thermal performance.
ESD CAUTION


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