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LFE250E-5T114I Fiches technique(PDF) 4 Page - Lattice Semiconductor

No de pièce LFE250E-5T114I
Description  LatticeECP2/M Family Data Sheet
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Fabricant  LATTICE [Lattice Semiconductor]
Site Internet  http://www.latticesemi.com
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LFE250E-5T114I Fiches technique(HTML) 4 Page - Lattice Semiconductor

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2-1
DS1006 Architecture_01.9
August 2008
Data Sheet DS1006
© 2008 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand
or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
Architecture Overview
Each LatticeECP2/M device contains an array of logic blocks surrounded by Programmable I/O Cells (PIC). Inter-
spersed between the rows of logic blocks are rows of sysMEM™ Embedded Block RAM (EBR) and rows of sys-
DSP™ Digital Signal Processing blocks, as shown in Figure 2-1. In addition, the LatticeECP2M family contains
SERDES Quads in one or more of the corners. Figure 2-2 shows the block diagram of ECP2M20 with one quad.
There are two kinds of logic blocks, the Programmable Functional Unit (PFU) and Programmable Functional Unit
without RAM (PFF). The PFU contains the building blocks for logic, arithmetic, RAM and ROM functions. The PFF
block contains building blocks for logic, arithmetic and ROM functions. Both PFU and PFF blocks are optimized for
flexibility, allowing complex designs to be implemented quickly and efficiently. Logic Blocks are arranged in a two-
dimensional array. Only one type of block is used per row.
The LatticeECP2/M devices contain one or more rows of sysMEM EBR blocks. sysMEM EBRs are large dedicated
18K fast memory blocks. Each sysMEM block can be configured in a variety of depths and widths of RAM or ROM.
In addition, LatticeECP2/M devices contain up to two rows of DSP Blocks. Each DSP block has multipliers and
adder/accumulators, which are the building blocks for complex signal processing capabilities.
The LatticeECP2M devices feature up to 16 embedded 3.125Gbps SERDES (Serializer / Deserializer) channels.
Each SERDES channel contains independent 8b/10b encoding / decoding, polarity adjust and elastic buffer logic.
Each group of four SERDES channels along with its Physical Coding Sub-layer (PCS) block, creates a quad. The
functionality of the SERDES/PCS Quads can be controlled by memory cells set during device configuration or by
registers that are addressable during device operation. The registers in every quad can be programmed by a soft
IP interface, referred to as the SERDES Client Interface (SCI). These quads (up to four) are located at the corners
of the devices.
Each PIC block encompasses two PIOs (PIO pairs) with their respective sysI/O buffers. The sysI/O buffers of the
LatticeECP2/M devices are arranged in eight banks, allowing the implementation of a wide variety of I/O standards.
In addition, a separate I/O bank is provided for the programming interfaces. PIO pairs on the left and right edges of
the device can be configured as LVDS transmit/receive pairs. The PIC logic also includes pre-engineered support
to aid in the implementation of high speed source synchronous standards such as SPI4.2, along with memory
interfaces including DDR2.
Other blocks provided include PLLs, DLLs and configuration functions. The LatticeECP2/M architecture provides
two General PLLs (GPLL) and up to six Standard PLLs (SPLL) per device. In addition, each LatticeECP2/M family
member provides two DLLs per device. The GPLLs and DLLs blocks are located in pairs at the end of the bottom-
most EBR row; the DLL block is located towards the edge of the device. The SPLL blocks are located at the end of
the other EBR/DSP rows.
The configuration block that supports features such as configuration bit-stream decryption, transparent updates
and dual boot support is located toward the center of this EBR row. The Ball Grid Array (BGA) package devices in
the LatticeECP2/M family supports a sysCONFIG™ port located in the corner between banks four and five, which
allows for serial or parallel device configuration.
In addition, every device in the family has a JTAG port. This family also provides an on-chip oscillator and soft error
detect capability. The LatticeECP2/M devices use 1.2V as their core voltage.
LatticeECP2/M Family Data Sheet
Architecture


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