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SN74AUC1G74 Fiches technique(PDF) 2 Page - Texas Instruments

No de pièce SN74AUC1G74
Description  SINGLE POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP
Download  15 Pages
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Fabricant  TI [Texas Instruments]
Site Internet  http://www.ti.com
Logo TI - Texas Instruments

SN74AUC1G74 Fiches technique(HTML) 2 Page - Texas Instruments

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TG
C
C
TG
C
C
TG
C
C
C
TG
C
C
CLR
CLK
D
PRE
Q
Q
C
6
2
7
3
5
1
SN74AUC1G74
SINGLE POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP
WITH CLEAR AND PRESET
SCES537D – DECEMBER 2003 – REVISED JUNE 2007
ORDERING INFORMATION
TA
PACKAGE(1)(2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING(3)
NanoFree™ – WCSP (DSBGA)
Reel of 3000
SN74AUC1G74YZPR
0.23-mm Large Bump – YZP (Pb-free)
_ _ _UP_
NanoFree™ – WCSP (DSBGA)
Reel of 3000
SN74AUC1G74YZTR
0.23-mm Large Bump – YZT (Pb-free)
–40
°C to 85°C
QFN – RSE
Reel of 3000
SN74AUC1G74RSER
UP
SSOP – DCT
Reel of 3000
SN74AUC1G74DCTR
U74_ _ _
VSSOP – DCU
Reel of 3000
SN74AUC1G74DCUR
U74_
(1)
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(3)
DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.
DCU: The actual top-side marking has one additional character that designates the assembly/test site.
YZP/YZT: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb,
• = Pb-free).
FUNCTION TABLE
INPUTS
OUTPUTS
PRE
CLR
CLK
D
Q
Q
L
H
X
X
H
L
X
L
X
X
L
H
H
H
H
H
L
H
H
L
L
H
H
H
L
X
Q0
Q 0
LOGIC DIAGRAM (POSITIVE LOGIC)
A.
Pin numbers shown are for the DCT, DCU, YZP, and YZT packages only.
2
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