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STK16C88-3WF35 Fiches technique(PDF) 9 Page - Simtek Corporation |
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STK16C88-3WF35 Fiches technique(HTML) 9 Page - Simtek Corporation |
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9 / 13 page  9 STK16C88-3 Jan, 2008 Document Control #ML0019 Rev 2.0 1. Read address 0E38 (hex) Valid READ 2. Read address 31C7 (hex) Valid READ 3. Read address 03E0 (hex) Valid READ 4. Read address 3C1F (hex) Valid READ 5. Read address 303F (hex) Valid READ 6. Read address 0FC0 (hex) Initiate STORE cycle The software sequence must be clocked with E controlled READs. Once the sixth address in the sequence has been entered, the STORE cycle will commence and the chip will be disabled. It is important that READ cycles and not WRITE cycles be used in the sequence, although it is not necessary that G be low for the sequence to be valid. After the t STORE cycle time has been fulfilled, the SRAM will again be activated for READ and WRITE operation. SOFTWARE NONVOLATILE RECALL A software RECALL cycle is initiated with a sequence of READ operations in a manner similar to the software STORE initiation. To initiate the RECALL cycle, the following sequence of READ operations must be performed: 1. Read address 0E38 (hex) Valid READ 2. Read address 31C7 (hex) Valid READ 3. Read address 03E0 (hex) Valid READ 4. Read address 3C1F (hex) Valid READ 5. Read address 303F (hex) Valid READ 6. Read address 0C63 (hex) Initiate RECALL cycle Internally, RECALL is a two-step procedure. First, the SRAM data is cleared, and second, the nonvola- tile information is transferred into the SRAM cells. After the t RECALL cycle time the SRAM will once again be ready for READ and WRITE operations. The RECALL operation in no way alters the data in the nonvolatile storage elements. The nonvolatile data can be recalled an unlimited number of times. HARDWARE PROTECT The STK16C88-3 offers hardware protection against inadvertent STORE operation and SRAM WRITE s during low-voltage conditions. When V CC < V SWITCH, all software STORE operations and SRAM WRITE s are inhibited. LOW AVERAGE ACTIVE POWER The STK16C88-3 draws significantly less current when it is cycled at rates slower than 35ns. Figure 2 shows the relationship between I CC and READ cycle time. Worst-case current consumption is shown for both CMOS and TTL input levels (commercial tem- perature range, V CC = 3.6V, 100% duty cycle on chip enable). Figure 3 shows the same relationship for WRITE cycles. If the chip enable duty cycle is less than 100%, only standby current is drawn when the chip is disabled. The overall average current drawn by the STK16C88-3 depends on the following items: 1) CMOS vs. TTL input levels; 2) the duty cycle of chip enable; 3) the overall cycle rate for accesses; 4) the ratio of READs to WRITEs; 5) the operating temperature; 6) the V CC level; and 7) I/O loading. Figure 2: ICC (max) Reads 0 10 20 30 40 50 50 100 150 200 Cycle Time (ns) TTL CMOS Figure 3: ICC (max) Writes 0 10 20 30 40 50 50 100 150 200 Cycle Time (ns) TTL CMOS |
Numéro de pièce similaire - STK16C88-3WF35 |
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Description similaire - STK16C88-3WF35 |
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