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TSF-6522 Fiches technique(PDF) 2 Page - List of Unclassifed Manufacturers

No de pièce TSF-6522
Description  No-Clean Tacky Soldering Flux
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TSF-6522 Fiches technique(HTML) 2 Page - List of Unclassifed Manufacturers

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The data and recommendations presented are based on tests which we consider reliable. Because Kester Solder has no control
over the conditions of use, we disclaim any responsibility connected with the use of any of our products or the information
presented. We advise that all chemical products be used only by or under the direction of technically qualified personnel who are
aware of the potential hazards involved and the necessity for reasonable care in their handling.
KESTER SOLDER
515 East Touhy Ave.
Des Plaines, IL 60018-2675
847 297 1600
847 390 9338 FAX
1-800-2-KESTER
www.kester.com
BRANCHES: ANAHEIM, CA
•••• JAMESTOWN, NY
BRANTFORD, ONTARIO, CANADA
•••• SINGAPORE •••• GERMANY •••• TAIWAN
Standard Applications:
• Works on flip chip, chip scale package and flip chip bumping sites assemblies as a soldering flux.
• Tacky solder flux formulations are designed for pin transfer, dot dispensing and/or syringe applications.
• Tacky solder flux formulations can be used as a tack and flux vehicle for soldering components to a solid solder
deposit (SSD), or precision pad technology (PPT) board surfaces.
• Great for rework applications on all PCB packages.
• Can be used in BGA/PGA sphere/pin attachment vehicle or for repair and reballing/repinning.
Application Notes
Reflow Profiles:
Plastic Ball Grid Array vs.Standard Kester Reflow Profile
TSF-6522 No-Clean Tacky Soldering Flux
Temperature (°C)
220
240
180
200
140
160
100
120
60
80
20
40
0
30
90
60
0
120
150
180
210
240
270
300
Time (Seconds)
330
1.75°C/sec.
0.50°C/sec.
0.33°C/sec.
Peak Temp.
210°C max.
Soak Zone (~120 sec.)
Reflow Zone
(45-60 sec.)
Secondary
Pre-heat Zone
(60-75 sec.)
Primary
Pre-heat Zone
(45-55sec.)
BGA Reflow Profile
Standard Reflow Profile
220
240
180
200
140
160
100
120
60
80
20
40
0
30
90
60
0
120
150
180
210
240
270
300
Time (Seconds)
Temperature (°C)
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1.3 - 1.6°C/Sec
Peak Temp.
210 - 235°C
Reflow Zone
TSF-6522 No-Clean Tacky Soldering Flux Reflow Profile
Standard Surface Mount Packages
( 2.0 min. max. )
~ 60 - 90 sec. ideal
Soaking Zone
0.5 - 0.6 °C/ Sec
<2.5° C/ Sec
. . . . . . . . .
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Pre-heating Zone
.
.( 2.0 - 4.0 min. max.)
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.
.
(30 - 90 sec. max.)
~40 - 60 sec. ideal
Printing Parameters:
Temperature/Humidity -- Optimal ranges for production are 21-25°C (70-77°F) and 35-65% R.H.
Activation Parameters:
Temperature -- Optimal activation temperatures are 130°-185°C (266-365°F). See “Soak Zone”
in diagrams above.
Cleaning:
Formula TSF-6522 is a no-clean formula. The residues do not need to be removed for typical applications.
Although formula TSF-6522 is designed for no-clean applications, its residues can be easily removed using
automated cleaning equipment (in-line or batch) with the aid of Kester Bio-Kleen #5768 saponifier in a 10-12%
concentration in de-ionized water at approximately 140°F (60°C).
Available Packaging:
Syringes -- 10 gram (10cc) and 30 gram (30cc) syringes available.
Cartridges -- 150 gram and 300 gram cartridges available.
Jars -- 50 gram and 100 gram jars available.
Storage, Handling, and Shelf Life:
Storage & Handling -- should be kept at standard refrigeration temperatures and humidity conditions, 0-10°C
(32-50°F) and 35-55% R.H. respectively.
Shelf life -- 4 months from date of manufacture when held at 0-10°C (32-50°F).
Health & Safety:
This product, during handling or use, may be hazardous to health or the environment.
Read the Material Safety Data Sheet and warning label before using this product.
Attention Specification Writers:


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