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TLRME50C Fiches technique(PDF) 1 Page - Toshiba Semiconductor |
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TLRME50C Fiches technique(HTML) 1 Page - Toshiba Semiconductor |
1 / 3 page TLRME50C(F) 2007-10-01 1 TOSHIBA InGaAℓP LED TLRME50C(F) ○ Panel Circuit Indicator • Lead(Pb)-free products (lead: Sn-Ag-Cu) • 3mm package wide viewing angle • InGaAℓP • Emitted color: Red • Colored, Transparent lens • Applications: Various types of information panels, indicators for amusement equipment and panel backlighting illumination sources. Absolute Maximum Ratings (Ta = 25°C) CHARACTERISTICS SYMBOL RATING UNIT FORWARD CURRENT IF 50 mA REVERSE VOLTAGE VR 4 V POWER DISSIPATION PD 120 mW OPERATING TEMPERATURE Topr −40~100 °C STORAGE TEMPERATURE Tstg −40~120 °C Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). ELECTRICAL AND OPTICAL CHARACTERISTICS (Ta = 25°C) CHARACTERISTICS SYMBOL TEST CONDITION MIN TYP MAX UNIT FORWARD VOLTAGE VF IF=20mA ⎯ 1.9 2.4 V REVERSE CURRENT IR VR=4V ⎯ ⎯ 50 μA LUMINOUS INTENSITY IV IF=20mA(Note) 1530 3500 ⎯ mcd PEAK WAVELENGTH λ P IF=20mA ⎯ (636) ⎯ nm SPECTRAL LINE HALF WIDTH Δλ IF=20mA ⎯ 23 ⎯ nm DOMINANT WAVELENGTH λ d IF=20mA ⎯ 626 ⎯ nm (Note):Lamps are classified into the following ranks according to their luminous intensity, and packed in boxes by each rank. T: 1530 −4140 mcd, U: 2720−7360 mcd, V: 4760mcd− Precautions Please be careful of the following: • Soldering temperature: 260°C max, soldering time: 3 s max (soldering portion of lead: up to 1.6 mm from the body of the device) • If the lead is formed, the lead should be formed up to 1.6 mm from the body of the device without forming stress to the resin. Soldering should be performed after lead forming. • This visible LED lamp also emits some IR light. If a photo detector is located near the LED lamp, please ensure that it will not be affected by this IR light. Unit : mm JEDEC - EIAJ - TOSHIBA 4 −3E1A Weight: 0.14 g(Typ.) |
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