Moteur de recherche de fiches techniques de composants électroniques |
|
TPS61160DRVR Fiches technique(PDF) 4 Page - Texas Instruments |
|
|
TPS61160DRVR Fiches technique(HTML) 4 Page - Texas Instruments |
4 / 21 page www.ti.com DEVICE INFORMATION VIN CTRL SW FB COMP GND TOP VIEW Thermal Pad 6-PIN2mmx2mmx0.8mmQFN TPS61160 TPS61161 SLVS791 – NOVEMBER 2007 ELECTRICAL CHARACTERISTICS (continued) VIN = 3.6 V, CTRL = VIN, TA = –40°C to 85°C, typical values are at TA = 25°C (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT EasyScale TIMING tstart Start time of program stream 2 µs tEOS End time of program stream 2 360 µs tH_LB High time low bit Logic 0 2 180 µs tL_LB Low time low bit Logic 0 2 × t H_LB 360 µs tH_HB High time high bit Logic 1 2 × t L_HB 360 µs tL_HB Low time high bit Logic 1 2 180 µs VACKNL Acknowledge output voltage low Open drain, Rpullup =15 k Ω to VIN 0.4 V tvalACKN Acknowledge valid time See (2) 2 µs tACKN Duration of acknowledge condition See (2) 512 µs THERMAL SHUTDOWN Tshutdown Thermal shutdown threshold 160 °C Thysteresis Thermal shutdown threshold hysteresis 15 °C (2) Acknowledge condition active 0, this condition will only be applied in case the RFA bit is set. Open drain output, line needs to be pulled high by the host with resistor load. TERMINAL FUNCTIONS TERMINAL I/O DESCRIPTION NAME NO. VIN 6 I The input supply pin for the IC. Connect VIN to a supply voltage between 2.7V and 18V. This is the switching node of the IC. Connect the inductor between the VIN and SW pin. This pin is also SW 4 I used to sense the output voltage for open LED protection GND 3 O Ground FB 1 I Feedback pin for current. Connect the sense resistor from FB to GND. Output of the transconductance error amplifier. Connect an external capacitor to this pin to compensate the COMP 2 O regulator. Control pin of the boost regulator. It is a multi-functional pin which can be used for enable control, PWM CTRL 5 I and digital dimming. The thermal pad should be soldered to the analog ground plane. If possible, use thermal via to connect to Thermal Pad ground plane for ideal power dissipation. 4 Submit Documentation Feedback Copyright © 2007, Texas Instruments Incorporated Product Folder Link(s): TPS61160 TPS61161 |
Numéro de pièce similaire - TPS61160DRVR |
|
Description similaire - TPS61160DRVR |
|
|
Lien URL |
Politique de confidentialité |
ALLDATASHEET.FR |
ALLDATASHEET vous a-t-il été utile ? [ DONATE ] |
À propos de Alldatasheet | Publicité | Contactez-nous | Politique de confidentialité | Echange de liens | Fabricants All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |