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STA2062 Fiches technique(PDF) 3 Page - STMicroelectronics |
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STA2062 Fiches technique(HTML) 3 Page - STMicroelectronics |
3 / 5 page STA2062 Package information 3/5 2 Package information In order to meet environmental requirements, ST offers this device in ECOPACK® packages. This package has a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 2. LFBGA361 (16x16x1.4mm) mechanical data & package dimensions OUTLINE AND MECHANICAL DATA DIM. mm inch MIN. TYP. MAX. MIN. TYP. MAX. A 1.400 0.0551 A1 0.210 0.0082 A2 0.985 0.0387 A3 0.200 0.0079 A4 0.800 0.0315 b 0.350 0.400 0.450 0.0138 0.0157 0.0177 D 15.850 16.000 16.150 0.6240 0.6299 0.6358 D1 14.400 0.5669 E 15.850 16.000 16.150 0.6240 0.6299 0.6358 E1 14.400 0.5669 e 0.800 0.0315 F 0.800 0.0315 ddd 0.100 0.0039 eee 0.150 0.0059 fff 0.080 0.0031 LFBGA361 Low profile Fine Pitch Ball Grid Array Body: 16 x 16 x 1.4mm 8033008 B |
Numéro de pièce similaire - STA2062 |
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Description similaire - STA2062 |
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