MITSUBISHI SEMICONDUCTOR <Dual-In-Line Package Intelligent Power Module>

PS21312

TRANSFER-MOLD TYPE

INSULATED TYPE

Aug. 1999

PS21312

INTEGRATED POWER FUNCTIONS

3rd generation IGBT inverter bridge for 3 phase DC-to-AC

power conversion.

APPLICATION

AC200V three-phase inverter drive for small power motor control.

Fig. 1 PACKAGE OUTLINES

MITSUBISHI SEMICONDUCTOR <Dual-In-Line Package Intelligent Power Module>

PS21312

TRANSFER-MOLD TYPE

INSULATED TYPE

INTEGRATED DRIVE, PROTECTION AND SYSTEM CONTROL FUNCTIONS

Note : Bootstrap supply scheme can be applied.

• Fault signaling : Corresponding to a SC fault (Low-side IGBT) or a UV fault (Low-side IGBT).

• Input interface : 5V line CMOS/TTL compatible, Schmitt Trigger receiver circuit.

* Note: The values used in the above figure are tentative.

(3.556)

(0.5)

(1.656)

(3.556)

(6.25)

(1.778)

(1.778

× 26)

(6.25) (6.25)

16

17

18

13

14

15

10

987

654

321

11

12

19

20

21

22

23

24

35

34

33

32

31

26 25

27

28

29

30

(8)

(8)

(5)

(1.25)

(2.5)

(35

°)

A

(1)

PCB

TERMINAL

TERMINAL CODE

1

VUFS

2

(UPG)

3

VUFB

4

VP1

5

(COM)

6

UP

7

VVFS

8

(VPG)

9

VVFB

10

VP1

11

(COM)

12

VP

13

VWFS

14

(WPG)

15

VWFB

16

VP1

17

(COM)

18

WP

19

(UNG)

20

VNO(NC)

21

UN

22

VN

23

WN

24

FO

25

CFO

26

CIN

27

VNC

28

VN1

29

(WNG)

30

(VNG)

31

P

32

U

33

V

34

W

35

N

PATTERN

SLIT

(PCB LAYOUT)

(1)

(1.9)

(0.5)

(1.8MIN)

(0.5)

(1)

HEAT SINK SIDE

Type name , Lot No.

DUMMY PIN

(φ2

DEPTH

2)

(φ3.3)

HEAT SINK SIDE

Detail A

*Note2

(7.62

× 4)

(7.62)

(41)

(42)

(49)

(4MIN)

*Note1:(***) = Dummy Pin.

*Note 2: In order to increase the surface distance between terminals, cut a slit, etc. on the PCB surface

when mounting a module.