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SN74CBT16211ADGVR Fiches technique(PDF) 3 Page - Texas Instruments

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No de pièce SN74CBT16211ADGVR
Description  24-BIT FET BUS SWITCH
Download  14 Pages
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Fabricant  TI [Texas Instruments]
Site Internet  http://www.ti.com
Logo TI - Texas Instruments

SN74CBT16211ADGVR Fiches technique(HTML) 3 Page - Texas Instruments

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SN74CBT16211A
24BIT FET BUS SWITCH
SCDS028M − JULY 1995 − REVISED SEPTEMBER 2003
3
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, VCC
−0.5 V to 7 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI (see Note 1)
−0.5 V to 7 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous channel current
128 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input clamp current, IIK (VI < 0)
−50 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance,
θJA (see Note 2): DGG package
64
°C/W
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DGV package
48
°C/W
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DL package
56
°C/W
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
GQL/ZQL package
42
°C/W
. . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg
−65
°C to 150°C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES:
1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 3)
MIN
MAX
UNIT
VCC
Supply voltage
4
5.5
V
VIH
High-level control input voltage
2
V
VIL
Low-level control input voltage
0.8
V
TA
Operating free-air temperature
−40
85
°C
NOTE 3: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP‡
MAX
UNIT
VIK
VCC = 4.5 V,
II = −18 mA
−1.2
V
II
VCC = 0 V,
VI = 5.5 V
10
A
II
VCC = 5.5 V,
VI = 5.5 V or GND
±1
µA
ICC
VCC = 5.5 V,
IO = 0,
VI = VCC or GND
3
µA
∆ICC§
Control inputs
VCC = 5.5 V,
One input at 3.4 V,
Other inputs at VCC or GND
2.5
mA
Ci
Control inputs
VI = 3 V or 0
3
pF
Cio(off)
VO = 3 V or 0,
OE = VCC
5.5
pF
VCC = 4 V,
TYP at VCC = 4 V
VI = 2.4 V,
II = 15 mA
14
20
ron¶
VI = 0
II = 64 mA
5
7
ron¶
VCC = 4.5 V
VI = 0
II = 30 mA
5
7
VCC = 4.5 V
VI = 2.4 V,
II = 15 mA
8
12
‡ All typical values are at VCC = 5 V (unless otherwise noted), TA = 25°C.
§ This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND.
¶ Measured by the voltage drop between the A and B terminals at the indicated current through the switch. On-state resistance is determined by
the lowest voltage of the two (A or B) terminals.


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