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TEA1566 Fiches technique(PDF) 10 Page - NXP Semiconductors

No de pièce TEA1566
Description  GreenChip; SMPS module
Download  24 Pages
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Fabricant  PHILIPS [NXP Semiconductors]
Site Internet  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

TEA1566 Fiches technique(HTML) 10 Page - NXP Semiconductors

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1999 Apr 20
10
Philips Semiconductors
Preliminary specification
GreenChip
™; SMPS module
TEA1566
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134); unless noted all voltages are measured with
respect to pin GND.
Notes
1. Repetitive clamped inductive turn-off energy <15 mJ.
2. Single pulse avalanche energy at Tj <25 °C: 570 mJ.
3. Equivalent to discharging a 100 pF capacitor through a 1.5 k
Ω resistor.
4. Equivalent to discharging a 200 pF capacitor through a 0.75 mH coil.
THERMAL CHARACTERISTICS
QUALITY SPECIFICATION
In accordance with
“SNW-FQ-611 part E”.
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VI(max)
maximum DC input voltage
600
V
during inductive turn-off;
note 1
720
V
ID
supply current
7A
VOOB
mode detect input voltage
−0.3
+14
V
IOOB
mode detect input current
−+2mA
Idemag
demagnetization input current
−±1mA
Vctrl
feedback input voltage
−0.3
+5
V
Vlsense
current sense input voltage
−0.3
+5
V
Iref
reference input current
−−1mA
Vaux
auxiliary supply voltage
−0.3
+18
V
Tj
operating junction temperature
−10
+140
°C
Tstg
storage temperature
−40
+150
°C
Ves
electrostatic handling voltage
class 2
human body model; note 3
2500
V
machine model; note 4
250
V
SYMBOL
PARAMETER
VALUE
UNIT
IC controller
Rth(j-a)
thermal resistance from junction to ambient
70
K/W
Rth(j-c)
thermal resistance from junction to case
31
K/W
Power FET
Rth(j-a)
thermal resistance from junction to ambient
37
K/W
Rth(j-c)
thermal resistance from junction to case
0.85
K/W


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