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STK11C68-CF35I Fiches technique(PDF) 9 Page - Simtek Corporation

No de pièce STK11C68-CF35I
Description  8Kx8 SoftStore nvSRAM
Download  16 Pages
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Fabricant  SIMTEK [Simtek Corporation]
Site Internet  http://www.simtek.com
Logo SIMTEK - Simtek Corporation

STK11C68-CF35I Fiches technique(HTML) 9 Page - Simtek Corporation

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9
February, 2007
Document Control #ML0007 Rev 0.3
STK11C68 (SMD5962–92324)
Internally, RECALL is a two-step procedure. First,
the SRAM data is cleared, and second, the nonvola-
tile information is transferred into the SRAM cells.
After the t
RECALL cycle time the SRAM will once again
be ready for READ and WRITE operations. The
RECALL
operation in no way alters the data in the
Nonvolatile Elements. The nonvolatile data can be
recalled an unlimited number of times.
POWER-UP RECALL
During power up, or after any low-power condition
(V
CC < VRESET), an internal RECALL request will be
latched. When V
CC once again exceeds the sense
voltage of V
SWITCH, a RECALL cycle will automatically
be initiated and will take t
RESTORE to complete.
If the STK11C68 is in a WRITE state at the end of
power-up RECALL, the SRAM data will be corrupted.
To help avoid this situation, a 10K Ohm resistor
should be connected either between W and system
V
CC or between E and system VCC.
HARDWARE PROTECT
The STK11C68 offers hardware protection against
inadvertent STORE operation during low-voltage
conditions. When V
CC
< V
SWITCH,
software STORE
operations are inhibited.
LOW AVERAGE ACTIVE POWER
The STK11C68 draws significantly less current
when it is cycled at times longer than 50ns. Figure 2
shows the relationship between I
CC and READ cycle
time. Worst-case current consumption is shown for
both CMOS and TTL input levels (commercial tem-
perature range, V
CC = 5.5V, 100% duty cycle on chip
enable). Figure 3 shows the same relationship for
WRITE
cycles. If the chip enable duty cycle is less
than 100%, only standby current is drawn when the
chip is disabled. The overall average current drawn
by the STK11C68 depends on the following items:
1) CMOS vs. TTL input levels; 2) the duty cycle of
chip enable; 3) the overall cycle rate for accesses;
4) the ratio of READs to WRITEs; 5) the operating
temperature; 6) the Vcc level; and 7) I/O loading.
Figure 2: ICC (max) Reads
0
20
40
60
80
100
50
100
150
200
Cycle Time (ns)
TTL
CMOS
Figure 3: ICC (max) Writes
0
20
40
60
80
100
50
100
150
200
Cycle Time (ns)
TTL
CMOS


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