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TC2117-3.0EB Fiches technique(PDF) 7 Page - Microchip Technology

No de pièce TC2117-3.0EB
Description  800 mA Fixed Low Dropout Positive Regulator
Download  18 Pages
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Fabricant  MICROCHIP [Microchip Technology]
Site Internet  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

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© 2006 Microchip Technology Inc.
DS21665C-page 7
TC2117
4.0
DETAILED DESCRIPTION
The TC2117 is a precision, positive output LDO. Unlike
bipolar regulators, the TC2117 supply current does not
increase proportionally with load current. In addition,
VOUT remains stable and within regulation over the
entire 0 mA to 800 mA operating load range.
FIGURE 4-1:
TYPICAL APPLICATION
CIRCUIT
4.1
Output Capacitor
A 1 µF (min) capacitor from VOUT to ground is required.
The output capacitor should have an effective series
resistance of 0.2
Ω to 10Ω. A 1 µF capacitor should be
connected from VIN to GND if there is more than 10
inches of wire between the regulator and the AC filter
capacitor, or if a battery is used as the power source.
Aluminum electrolytic or tantalum capacitor types can
be used. (Since many aluminum electrolytic capacitors
freeze at approximately -30°C, solid tantalums are
recommended for applications operating below -25°C.)
When operating from sources other than batteries,
supply noise rejection and transient response can be
improved by increasing the value of the input and
output capacitors and employing passive filtering
techniques.
4.2
Thermal Considerations
4.2.1
THERMAL SHUTDOWN
Integrated thermal protection circuitry shuts the regula-
tor off when die temperature exceeds 160°C. The
regulator remains off until the die temperature drops to
approximately 150°C.
4.2.2
POWER DISSIPATION
The amount of power the regulator dissipates is prima-
rily a function of input and output voltage, and output
current. The following equation is used to calculate
worst case actual power dissipation:
EQUATION 4-1:
The
maximum
allowable
power
dissipation
(Equation 4-2) is a function of the maximum ambient
temperature (TAMAX), the maximum allowable die
temperature (+125°C) and the thermal resistance from
junction-to-air (
θJA).
EQUATION 4-2:
Table 4-1 shows various values of
θJA for the TC2117
mounted on a 1/16 inch, 2-layer PCB with 1 oz. copper
foil.
TABLE 4-1:
THERMAL RESISTANCE
GUIDELINES FOR TC2117 IN
3-PIN SOT-223 PACKAGE
C1
1µF
Battery
TC2117
VIN
VOUT
C2
1µF
GND
VOUT
Copper
Area
(Topside)*
Copper
Area
(Backside)
Board Area
Thermal
Resistance
2500 sq mm
2500 sq mm
2500 sq mm
45°C/W
1000 sq mm
2500 sq mm
2500 sq mm
45°C/W
225 sq mm
2500 sq mm
2500 sq mm
53°C/W
100 sq mm
2500 sq mm
2500 sq mm
59°C/W
1000 sq mm
1000 sq mm
1000 sq mm
52°C/W
1000 sq mm
0 sq mm
1000 sq mm
55°C/W
* Tab of device attached to topside copper.
Where:
VINMAX
VOUTMIN
ILOADMAX
PD = Worst-case actual power dissipation
= Minimum regulator output voltage
= Maximum output (load) current
= Maximum voltage on VIN
PD
VINMAX VOUTMIN
()I
LOADMAX
=
PDMAX = (TJMAX – TAMAX)
θJA
Where all terms are previously defined.


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