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TDA8395 Fiches technique(PDF) 9 Page - NXP Semiconductors |
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TDA8395 Fiches technique(HTML) 9 Page - NXP Semiconductors |
9 / 10 page October 1991 9 Philips Semiconductors Preliminary specification SECAM decoder TDA8395 PACKAGE OUTLINE UNIT A max. 1 2 b1 cE e MH L REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ mm inches DIMENSIONS (inch dimensions are derived from the original mm dimensions) SOT38-1 92-10-02 95-01-19 A min. A max. b max. w ME e 1 1.40 1.14 0.055 0.045 0.53 0.38 0.32 0.23 21.8 21.4 0.86 0.84 6.48 6.20 0.26 0.24 3.9 3.4 0.15 0.13 0.254 2.54 7.62 0.30 8.25 7.80 0.32 0.31 9.5 8.3 0.37 0.33 2.2 0.087 4.7 0.51 3.7 0.15 0.021 0.015 0.013 0.009 0.01 0.10 0.020 0.19 050G09 MO-001AE MH c (e ) 1 ME A L A1 w M b1 e D A2 Z 16 1 9 8 b E pin 1 index 0 5 10 mm scale Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. (1) (1) D (1) Z DIP16: plastic dual in-line package; 16 leads (300 mil); long body SOT38-1 |
Numéro de pièce similaire - TDA8395 |
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Description similaire - TDA8395 |
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