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TDA8002C Fiches technique(PDF) 3 Page - NXP Semiconductors |
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TDA8002C Fiches technique(HTML) 3 Page - NXP Semiconductors |
3 / 28 page 1999 Oct 12 3 Philips Semiconductors Product specification IC card interface TDA8002C QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supplies VDD supply voltage 3.0 − 6.5 V IDD(lp) supply current low-power −− 150 µA IDD(idle) supply current Idle mode; fCLKOUT = 10 MHz −− 5mA IDD(active) supply current active mode; VCC(O) =5V; fCLKOUT =10MHz fCLK = LOW; ICC = 100 µA −− 8mA fCLK = 5 MHz; ICC =10mA −− 50 mA fCLK = 5 MHz; ICC =55mA −− 140 mA active mode; VCC(O) =3V; fCLKOUT =10MHz fCLK = LOW; ICC = 100 µA −− 8mA fCLK = 5 MHz; ICC =10mA −− 50 mA fCLK = 5 MHz; ICC =55mA −− 140 mA Card supply VCC(O) output voltage active mode for VCC =5V ICC < 55 mA; DC load 4.6 − 5.4 V ICC = 40 nAs; AC load 4.6 − 5.4 V active mode for VCC =3V ICC < 55 mA; DC load 2.76 − 3.24 V ICC = 40 nAs; AC load 2.76 − 3.24 V General fCLK card clock frequency 0 − 12 MHz tde deactivation sequence duration 60 80 100 µs Ptot continuous total power dissipation TDA8002CT/x Tamb = −25 to +85 °C −− 0.56 W TDA8002CG Tamb = −25 to +85 °C −− 0.46 W Tamb ambient temperature −25 − +85 °C |
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