BI Technologies Corporation

4200 Bonita Place, Fullerton, CA 92835 USA

Phone: 714 447 2345

August 30, 2005

page 1 of 2

BI technologies

MODEL BB1110RC

MODEL BB1110RC

MODEL BB1110RC

MODEL BB1110RC

Resistor capacitor network

Thick film resistors

Ceramic chip capacitors

DISCRIPTION

DISCRIPTION

DISCRIPTION

DISCRIPTION

Model BB1110RC is designed for terminating high-speed memory buses. Ideally suited for local

decoupling of data line drivers. These specialty networks employ solder balls for surface mount flip

chip attachment. Their unique construction yields extremely low capacitance and inductance

parasitics critical for these high-speed applications.

FEATURES

FEATURES

FEATURES

FEATURES

•

Integrated resistor and capacitor network

•

High density packaging

•

High temperature solder balls

•

Industry standard ball diameter and pitch

•

Excellent high frequency performance

SCHEMATIC

SCHEMATIC

SCHEMATIC

SCHEMATIC

C1-9 = 0.1uF

R1-9 = 50

ELECTRICAL

ELECTRICAL

ELECTRICAL

ELECTRICAL

1

1

1

1

Resistance Tolerance

± 1%

Capacitance Tolerance

± 10%

Capacitor Type

X5R

Capacitor Maximum Voltage

10 volts

TCR

200 ppm/°C

Operating Temperature Range

-55°C to +85°C

Maximum Resistor Power

0.05 watts at 70°C

Package Power Rating

1.0 watt @ 70°C

1

Specifications subject to change without notice.