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TDA4565 Fiches technique(PDF) 10 Page - NXP Semiconductors |
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TDA4565 Fiches technique(HTML) 10 Page - NXP Semiconductors |
10 / 11 page November 1989 10 Philips Semiconductors Product specification Colour transient improvement circuit TDA4565 PACKAGE OUTLINE REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ SOT102-1 93-10-14 95-01-23 UNIT A max. 12 b1 (1) (1) (1) b2 cD E e M Z H L mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) A min. A max. b max. w ME e 1 1.40 1.14 0.53 0.38 0.32 0.23 21.8 21.4 6.48 6.20 3.9 3.4 0.254 2.54 7.62 8.25 7.80 9.5 8.3 0.85 4.7 0.51 3.7 inches 0.055 0.044 0.021 0.015 0.013 0.009 1.40 1.14 0.055 0.044 0.86 0.84 0.26 0.24 0.15 0.13 0.01 0.10 0.30 0.32 0.31 0.37 0.33 0.033 0.19 0.020 0.15 MH c (e ) 1 ME A L A1 w M b1 b2 e D A2 Z 18 1 10 9 b E pin 1 index 0 5 10 mm scale Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. DIP18: plastic dual in-line package; 18 leads (300 mil) SOT102-1 |
Numéro de pièce similaire - TDA4565 |
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Description similaire - TDA4565 |
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