Moteur de recherche de fiches techniques de composants électroniques |
|
CD827 Fiches technique(PDF) 1 Page - Microsemi Corporation |
|
CD827 Fiches technique(HTML) 1 Page - Microsemi Corporation |
1 / 2 page 177 MAXIMUM RATINGS Operating Temperature: -65°C to +175°C Storage Temperature: -65°C to +175°C REVERSE LEAKAGE CURRENT lR = 2 µA @ 25°C & VR = 3 Vdc ELECTRICAL CHARACTERISTICS @ 25°C, unless otherwise specified. -55° TO +100° CDI ZENER ZENER MAXIMUM VOLTAGE EFFECTIVE TYPE VOLTAGE TEST ZENER TEMPERATURE TEMPERATURE NUMBER CURRENT IMPEDANCE STABILITY COEFFICIENT V ZT @ I ZT I ZT Z ZT ³V ZT (Note 1) (Note 2) VOLTS mA OHMS mV % / °C CD821 5.9 - 6.5 7.5 15 96 0.01 CD821A 5.9 - 6.5 7.5 10 96 0.01 CD823 5.9 - 6.5 7.5 15 48 0.005 CD823A 5.9 - 6.5 7.5 10 48 0.005 CD825 5.9 - 6.5 7.5 15 19 0.002 CD825A 5.9 - 6.5 7.5 10 19 0.002 CD826 5.9 - 6.5 7.5 15 20 0.002 CD827 5.9 - 6.5 7.5 15 9 0.001 CD827A 5.9 - 6.5 7.5 10 9 0.001 CD828 6.2 - 6.9 7.5 15 10 0.001 CD829 5.9 - 6.5 7.5 15 5 0.0005 CD829A 5.9 - 6.5 7.5 10 5 0.0005 NOTE 1 Zener impedance is derived by superimposing on l ZT A 60Hz rms a.c. current equal to 10% of l ZT. NOTE 2 The maximum allowable change observed over the entire temperature range i.e.,the diode voltage will not exceed the specified mV at any discrete temperature between the established limits, per JEDEC standard No.5. Backside is not cathode and must be electrically isolated T = Metallization Test Pad DESIGN DATA METALLIZATION: Top: C (Cathode) ..................Al A (Anode) ..................... Al Back: .......................................Au AL THICKNESS.........25,000 Å Min GOLD THICKNESS......4,000 Å Min CHIP THICKNESS. ..............10 Mils CIRCUIT LAYOUT DATA: Backside must be electrically isolated. Backside is not cathode. For Zener operation cathode must be operated positive with respect to anode. TOLERANCES: ALL Dimensions + 2 mils • 1N821 THRU 1N829 AVAILABLE IN JANHC AND JANKC PER MIL-PRF-19500/159 • MONOLITHIC TEMPERATURE COMPENSATED ZENER REFERENCE CHIPS • ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE • ELECTRICALLY EQUIVALENT TO 1N821 THRU 1N829 • COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES, WITH THE EXCEPTION OF SOLDER REFLOW CD821 thru CD829A 6 LAKE STREET, LAWRENCE, MASSACHUSETTS 01841 PHONE (978) 620-2600 FAX (978) 689-0803 WEBSITE: http://www.microsemi.com |
Numéro de pièce similaire - CD827 |
|
Description similaire - CD827 |
|
|
Lien URL |
Politique de confidentialité |
ALLDATASHEET.FR |
ALLDATASHEET vous a-t-il été utile ? [ DONATE ] |
À propos de Alldatasheet | Publicité | Contactez-nous | Politique de confidentialité | Echange de liens | Fabricants All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |