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SL1ICS3101 Fiches technique(PDF) 2 Page - NXP Semiconductors

No de pièce SL1ICS3101
Description  I.CODE1 Label IC 97pF Chip Specification
Download  22 Pages
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Fabricant  PHILIPS [NXP Semiconductors]
Site Internet  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

SL1ICS3101 Fiches technique(HTML) 2 Page - NXP Semiconductors

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Product Specification
SL1 ICS31 01
Rev. 1.2
July 2000
Page 2 of 22
Public
1 Contents
1
CONTENTS
2
2
DEFINITIONS
4
2.1
Life Support Applications .................................................................................................... 4
2.2
Abbreviations ........................................................................................................................ 4
3
SCOPE
5
4
ORDERING INFORMATION
5
5
FUNCTIONAL DESCRIPTION
6
5.1
Basic Features ....................................................................................................................... 6
5.2
Block Diagram of the IC....................................................................................................... 6
5.3
Memory Organisation........................................................................................................... 7
5.3.1
Serial Number................................................................................................................... 7
5.3.2
Write Access Conditions .................................................................................................. 7
5.3.3
Special Functions (EAS/QUIET)..................................................................................... 8
5.3.4
Family Code and Application Identifier........................................................................... 8
5.3.5
Configuration of delivered ICs......................................................................................... 8
6
MECHANICAL DIE SPECIFICATIONS
9
7
MECHANICAL WAFER SPECIFICATIONS
10
7.1
Wafer Status ........................................................................................................................ 10
7.2
Backside Treatment ............................................................................................................ 10
8
DOCUMENTATION
11
8.1
Delivery Documentation..................................................................................................... 11
8.2
Fail-Die Identification......................................................................................................... 11
8.2.1
Ink Dot Specification...................................................................................................... 11
8.2.2
Wafer Mapping............................................................................................................... 11
9
QUALITY ASSURANCE
12
9.1
Electrical Acceptance Test................................................................................................. 12
9.2
Visual Inspection................................................................................................................. 12
9.2.1
After Wafer Final Test.................................................................................................... 12
9.2.2
After Sawing (Film Frame Carrier)................................................................................ 12
10
PACKING
13
10.1 Storage Recommendations ................................................................................................. 13
10.2 Possible Forms of Delivery ................................................................................................. 13
10.2.1 Packing of Unsawn Wafers............................................................................................ 13
10.2.2 Packing of Sawn Wafers ................................................................................................ 13


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