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SL1ICS3101 Fiches technique(PDF) 2 Page - NXP Semiconductors |
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SL1ICS3101 Fiches technique(HTML) 2 Page - NXP Semiconductors |
2 / 22 page Product Specification SL1 ICS31 01 Rev. 1.2 July 2000 Page 2 of 22 Public 1 Contents 1 CONTENTS 2 2 DEFINITIONS 4 2.1 Life Support Applications .................................................................................................... 4 2.2 Abbreviations ........................................................................................................................ 4 3 SCOPE 5 4 ORDERING INFORMATION 5 5 FUNCTIONAL DESCRIPTION 6 5.1 Basic Features ....................................................................................................................... 6 5.2 Block Diagram of the IC....................................................................................................... 6 5.3 Memory Organisation........................................................................................................... 7 5.3.1 Serial Number................................................................................................................... 7 5.3.2 Write Access Conditions .................................................................................................. 7 5.3.3 Special Functions (EAS/QUIET)..................................................................................... 8 5.3.4 Family Code and Application Identifier........................................................................... 8 5.3.5 Configuration of delivered ICs......................................................................................... 8 6 MECHANICAL DIE SPECIFICATIONS 9 7 MECHANICAL WAFER SPECIFICATIONS 10 7.1 Wafer Status ........................................................................................................................ 10 7.2 Backside Treatment ............................................................................................................ 10 8 DOCUMENTATION 11 8.1 Delivery Documentation..................................................................................................... 11 8.2 Fail-Die Identification......................................................................................................... 11 8.2.1 Ink Dot Specification...................................................................................................... 11 8.2.2 Wafer Mapping............................................................................................................... 11 9 QUALITY ASSURANCE 12 9.1 Electrical Acceptance Test................................................................................................. 12 9.2 Visual Inspection................................................................................................................. 12 9.2.1 After Wafer Final Test.................................................................................................... 12 9.2.2 After Sawing (Film Frame Carrier)................................................................................ 12 10 PACKING 13 10.1 Storage Recommendations ................................................................................................. 13 10.2 Possible Forms of Delivery ................................................................................................. 13 10.2.1 Packing of Unsawn Wafers............................................................................................ 13 10.2.2 Packing of Sawn Wafers ................................................................................................ 13 |
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