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SL1ICS3101 Fiches technique(PDF) 5 Page - NXP Semiconductors

No de pièce SL1ICS3101
Description  I.CODE1 Label IC 97pF Chip Specification
Download  22 Pages
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Fabricant  PHILIPS [NXP Semiconductors]
Site Internet  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

SL1ICS3101 Fiches technique(HTML) 5 Page - NXP Semiconductors

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Product Specification
SL1 ICS31 01
Rev. 1.2
July 2000
Page 5 of 22
Public
3 Scope
This specification describes the electrical, physical and dimensional properties of unsawn and sawn
wafers on FFC of I•CODE1 Label ICs (Cres = 97 pF) on a Philips 6C15 IDFW process and is the
base for delivery of tested I•CODE1 Label ICs.
General recommendations are given for storage, handling and processing of wafers as well as
assembly of labels.
Reference documents:
MIL-STD 883D Method 3023
MIL-STD 883D Method 3015
SNW-FQ-627
PICTOH-QS007
General Specification for 6” Wafer
General Quality Specification
I•CODE Label IC, Coil Design Guide
This product specification is valid for mask revision: VCOL1V0
NK: O
MB: B
4 Ordering Information
Following ordering options are available:
Type Name
Description
Ordering Code
SL1 ICS31 01W/N5D
Sawn wafer on foil (FFC), 150 µm, inked and mapped
9352 670 53005
SL1 ICS31 01U/N5D
Unsawn wafer, 150 µm, inked and mapped
9352 670 50025
SL1 ICS31 01U/L6D
Unsawn wafer, 525 µm, mapped (not inked)
9352 670 59025


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