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SL1ICS3101 Fiches technique(PDF) 5 Page - NXP Semiconductors |
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SL1ICS3101 Fiches technique(HTML) 5 Page - NXP Semiconductors |
5 / 22 page Product Specification SL1 ICS31 01 Rev. 1.2 July 2000 Page 5 of 22 Public 3 Scope This specification describes the electrical, physical and dimensional properties of unsawn and sawn wafers on FFC of I•CODE1 Label ICs (Cres = 97 pF) on a Philips 6C15 IDFW process and is the base for delivery of tested I•CODE1 Label ICs. General recommendations are given for storage, handling and processing of wafers as well as assembly of labels. Reference documents: MIL-STD 883D Method 3023 MIL-STD 883D Method 3015 SNW-FQ-627 PICTOH-QS007 General Specification for 6” Wafer General Quality Specification I•CODE Label IC, Coil Design Guide This product specification is valid for mask revision: VCOL1V0 NK: O MB: B 4 Ordering Information Following ordering options are available: Type Name Description Ordering Code SL1 ICS31 01W/N5D Sawn wafer on foil (FFC), 150 µm, inked and mapped 9352 670 53005 SL1 ICS31 01U/N5D Unsawn wafer, 150 µm, inked and mapped 9352 670 50025 SL1 ICS31 01U/L6D Unsawn wafer, 525 µm, mapped (not inked) 9352 670 59025 |
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