I•CODE1 Chip Specification

Rev. 2.1

May 2000

SL040521.doc/M

Public

Page 11 of 22

8 Documentation

8.1 Delivery Documentation

Each wafer container and each larger shipment container is individually marked with the

identification information as follows:

• Diffusion Batch number (wafer lot number)

• Part designation (type) with revision number

• Ordering code (see chapter 4)

• Date code of lot acceptation

• Good die quantity

The print out of the final test results is attached to the packing and contains the good die quantity

related to every wafer number.

8.2 Fail-Die Identification

Every die is electrically tested according to data sheet. Identification of chips, which do not confirm

with the electrical parameters of the data sheet is done by inking and/or wafer mapping (all dies at

wafer periphery are identified by ‘FAIL’).

8.2.1 Ink Dot Specification

Diameter:

min. 0.4 mm

Height:

max. 20 µm

Colour:

black

Position:

central third of die (x, y direction)

Attributes:

opaque, water resistant

NOTE: Uncompleted dies with an area < 95 % (wafer periphery) are not inked!

8.2.2 Wafer Mapping

Wafer mapping for failed die identification is available on Floppy-Disk.

Format:

Electroglas ESC–ASCEND on 3.5

″ Floppy-Disk

NOTE: The wafer map refers to unsawn wafers. At sawn wafers (on FFC) additional ICs

might be inked (marked as fail) if damaged during the sawing process (compared to

wafer map)!

See Appendix D for an example of the wafer map.