NSS12600CF8T1G

http://onsemi.com

5

PACKAGE DIMENSIONS

ChipFET

CASE 1206A−03

ISSUE G

0.457

0.018

2.032

0.08

0.635

0.025

0.66

0.026

0.711

0.028

mm

inches

SCALE 20:1

0.178

0.007

2.032

0.08

1.727

0.068

0.66

0.026

0.711

0.028

mm

inches

SCALE 20:1

Style 4

Basic

0.457

0.018

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

E

A

b

e

e1

D

12

34

87

65

c

L

1

2

3

4

8

7

6

5

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. MOLD GATE BURRS SHALL NOT EXCEED 0.13 MM PER SIDE.

4. LEADFRAME TO MOLDED BODY OFFSET IN HORIZONTAL

AND VERTICAL SHALL NOT EXCEED 0.08 MM.

5. DIMENSIONS A AND B EXCLUSIVE OF MOLD GATE BURRS.

6. NO MOLD FLASH ALLOWED ON THE TOP AND BOTTOM LEAD

SURFACE.

0.05 (0.002)

DIM

A

MIN

NOM

MAX

MIN

MILLIMETERS

1.00

1.05

1.10

0.039

INCHES

b

0.25

0.30

0.35

0.010

c

0.10

0.15

0.20

0.004

D

2.95

3.05

3.10

0.116

E

1.55

1.65

1.70

0.061

e

0.65 BSC

e1

0.55 BSC

L

0.28

0.35

0.42

0.011

0.041

0.043

0.012

0.014

0.006

0.008

0.120

0.122

0.065

0.067

0.025 BSC

0.022 BSC

0.014

0.017

NOM

MAX

1.80

1.90

2.00

0.071

0.075

0.079

5° NOM

q

5° NOM

q

ON Semiconductor and

are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice

to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability

arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.

“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All

operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights

nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications

intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should

Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,

and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death

associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal

Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

PUBLICATION ORDERING INFORMATION

N. American Technical Support: 800−282−9855 Toll Free

USA/Canada

Europe, Middle East and Africa Technical Support:

Phone: 421 33 790 2910

Japan Customer Focus Center

Phone: 81−3−5773−3850

NSS12600CF8/D

ChipFET is a trademark of Vishay Siliconix.

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For additional information, please contact your local

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