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CDCL6010RGZR Fiches technique(PDF) 3 Page - Texas Instruments

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No de pièce CDCL6010RGZR
Description  1.8V, 11 Output Clock Multiplier, Distributor, Jitter Cleaner, and Buffer
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Fabricant  TI [Texas Instruments]
Site Internet  http://www.ti.com
Logo TI - Texas Instruments

CDCL6010RGZR Fiches technique(HTML) 3 Page - Texas Instruments

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ABSOLUTE MAXIMUM RATINGS
RECOMMENDED OPERATING CONDITIONS
CDCL6010
SLLS780 – FEBRUARY 2007
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
AVAILABLE OPTIONS(1)
TA
PACKAGED DEVICES
FEATURES
–40
°C to +85°C
CDCL6010RGZT
48-pin QFN (RGZ) Package, small tape and reel
–40
°C to +85°C
CDCL6010RGZR
48-pin QFN (RGZ) Package, tape and reel
(1)
For the most current specifications and package information, see the Package Option Addendum located at the end of this data sheet or
refer to our web site at www.ti.com.
over operating free-air temperature range (unless otherwise noted).(1)
VALUE
UNIT
VDD, AVDD
Supply voltage(2)
–0.3 to 2.5
V
VLVDS
Voltage range at LVDS input pins(2)
–0.3 to 4.0
V
VI
Voltage range at all non-LVDS input pins(2)
–0.3 to 3.0
V
ESD
Electrostatic discharge (HBM)
2
kV
TJ
Junction temperature
+125
°C
TSTG
Storage temperature range
–65 to +150
°C
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
condition is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltage values are with respect to network ground terminal.
Over operating free-air temperature range (unless otherwise noted).
MIN
NOM
MAX
UNIT
VDD
Digital supply voltage
1.7
1.8
1.9
V
AVDD
Analog supply voltage
1.7
1.8
1.9
V
TA
Ambient temperature (no airflow, no heatsink)
–40
+85
°C
TJ
Junction temperature
+105
°C
θ
JA
Junction-to-ambient thermal resistance(1):
airflow = 0 lfm
28.3
°C/W
airflow = 50 lfm
22.4
(1)
No heatsink; power uniformly distributed; 36 ground vias (6 x 6 array) tied to the thermal exposed pad; 4-layer high-K board.
3
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