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FCA47N60 Fiches technique(PDF) 1 Page - Fairchild Semiconductor

No de pièce FCA47N60
Description  new generation of high voltage MOSFET
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Fabricant  FAIRCHILD [Fairchild Semiconductor]
Site Internet  http://www.fairchildsemi.com
Logo FAIRCHILD - Fairchild Semiconductor

FCA47N60 Fiches technique(HTML) 1 Page - Fairchild Semiconductor

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©2006 Fairchild Semiconductor Corporation
1
www.fairchildsemi.com
FCH47N60 / FCA47N60 Rev.B
SuperFETTM
December 2006
FCH47N60 / FCA47N60
Features
•650V @TJ = 150°C
• Typ. Rds(on)=0.058
Ω
• Ultra low gate charge (typ. Qg=210nC)
• Low effective output capacitance (typ. Coss.eff=420pF)
• 100% avalanche tested
Description
SuperFETTM is, Farichild’s proprietary, new generation of high
voltage MOSFET family that is utilizing an advanced charge
balance mechanism for outstanding low on-resistance and
lower gate charge performance.
This advanced technology has been tailored
to minimize
conduction loss, provide superior switching performance, and
withstand extreme dv/dt rate and higher avalanche energy.
Consequently, SuperFET is very suitable for various AC/DC
power conversion in switching mode operation for system
miniaturization and higher efficiency.
Absolute Maximum Ratings
Thermal Characteristics
G
S
D
TO-247
FDH Series
GS
D
TO-3P
FDA Series
D
G
S
Symbol
Parameter
FCH47N60
FCA47N60
Unit
VDSS
Drain-Source Voltage
600
V
ID
Drain Current
- Continuous (TC = 25°C)
- Continuous (TC = 100°C)
47
29.7
A
A
IDM
Drain Current
- Pulsed
(Note 1)
141
A
VGSS
Gate-Source voltage
± 30
V
EAS
Single Pulsed Avalanche Energy
(Note 2)
1800
mJ
IAR
Avalanche Current
(Note 1)
47
A
EAR
Repetitive Avalanche Energy
(Note 1)
41.7
mJ
dv/dt
Peak Diode Recovery dv/dt
(Note 3)
4.5
V/ns
PD
Power Dissipation
(TC = 25°C)
- Derate above 25
°C
417
3.33
W
W/
°C
TJ, TSTG
Operating and Storage Temperature Range
-55 to +150
°C
TL
Maximum Lead Temperature for Soldering Purpose,
1/8” from Case for 5 Seconds
300
°C
Symbol
Parameter
Typ.
Max.
Unit
RθJC
Thermal Resistance, Junction-to-Case
--
0.3
°C/W
RθCS
Thermal Resistance, Case-to-Sink
0.24
--
°C/W
RθJA
Thermal Resistance, Junction-to-Ambient
--
41.7
°C/W


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