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Moteur de recherche de fiches techniques de composants électroniques |
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SBR2U30P1 Fiches technique(PDF) 1 Page - Diodes Incorporated |
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SBR2U30P1 Fiches technique(HTML) 1 Page - Diodes Incorporated |
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1 / 4 page  SBR2U30P1 2.0A SBR ® Super Barrier Rectifier PowerDI™123 Features Mechanical Data • Case: PowerDI™123 • Case Material: Molded Plastic, “Green” Molding compound. UL Flammability Classification Rating 94V-0 • Moisture Sensitivity: Level 1 per J-STD-020C • Polarity Indicator: Cathode Band • Terminals: Matte Tin Finish annealed over Copper leadframe. Solderable per MIL-STD-202, Method 208 • Marking Information: See Page 4 • Ordering Information: See Page 4 • Ultra Low Forward Voltage Drop • Superior Reverse Avalanche Capability • Patented Interlocking Clip Design for High Surge Current Capacity • Patented Super Barrier Rectifier Technology • Soft, Fast Switching Capability • 150ºC Operating Junction Temperature • ±16KV ESD Protection (HBM, 3B) • ±25KV ESD Protection (IEC61000-4-2 Level 4, Air Discharge) • Lead Free Finish, RoHS Compliant (Note 1) • “Green” Molding Compound (No Br, Sb) • Qualified to AEC-Q 101 Standards for High Reliability Maximum Ratings @ T A = 25ºC unless otherwise specified Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%. Characteristic Symbol Value Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage VRRM VRWM VRM 30 V RMS Reverse Voltage VR(RMS) 21 V Average Rectified Output Current (See Figure 1) IO 2.0 A Non-Repetitive Peak Forward Surge Current 8.3ms Single Half Sine-Wave Superimposed on Rated Load IFSM 75 A Non-Repetitive Avalanche Energy (TJ = 25°C, IAS = 5A, L = 8.5 mH) EAS 105 mJ Repetitive Peak Avalanche Energy (TP = 1µs, Tj = 25°C) PARM 1100 W Maximum Thermal Resistance Thermal Resistance Junction to Soldering (Note 2) Thermal Resistance Junction to Ambient (Note 3) Thermal Resistance Junction to Ambient (Note 4) RӨJS RӨJA 5 178 123 °C/W Operating and Storage Temperature Range TJ, TSTG -65 to +150 ºC Notes: 1. RoHS revision 13.2.2003. High temperature solder exemption applied, see EU Directive Annex Note 7. 2. Theoretical RӨJS calculated from the top center of the die straight down to the PCB cathode tab solder junction. 3. FR-4 PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf. 4. Polymide PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf __________ SBR is a registered trademark of Diodes Incorporated. PowerDI is a trademark of Diodes Incorporated. SBR2U30P1 Rev. 4 - 2 1 of 4 www.diodes.com January 2007 © Diodes Incorporated |
Numéro de pièce similaire - SBR2U30P1 |
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Description similaire - SBR2U30P1 |
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