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Moteur de recherche de fiches techniques de composants électroniques |
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Moteur de recherche de fiches techniques de composants électroniques |
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BYD37J Fiches technique(PDF) 2 Page - NXP Semiconductors |
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BYD37J Fiches technique(HTML) 2 Page - NXP Semiconductors |
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2 / 12 page  1999 Nov 16 2 Philips Semiconductors Product specification Fast soft-recovery controlled avalanche rectifiers BYD37 series FEATURES • Glass passivated • High maximum operating temperature • Low leakage current • Excellent stability • Guaranteed avalanche energy absorption capability • Smallest surface mount rectifier outline • Shipped in 8 mm embossed tape. DESCRIPTION Cavity free cylindrical glass package through Implotec ™(1) technology. This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched. (1) Implotec is a trademark of Philips. handbook, 4 columns MAM061 ka Fig.1 Simplified outline (SOD87) and symbol. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VRRM repetitive peak reverse voltage BYD37D − 200 V BYD37G − 400 V BYD37J − 600 V BYD37K − 800 V BYD37M − 1000 V VR continuous reverse voltage BYD37D − 200 V BYD37G − 400 V BYD37J − 600 V BYD37K − 800 V BYD37M − 1000 V IF(AV) average forward current Ttp = 105 °C; see Fig.2; averaged over any 20 ms period; see also Fig.6 − 1.5 A IF(AV) average forward current Tamb =60 °C; PCB mounting (see Fig.11); see Fig.3; averaged over any 20 ms period; see also Fig.6 − 0.6 A IFRM repetitive peak forward current Ttp = 105 °C; see Fig.4 − 13 A Tamb =60 °C; see Fig.5 − 5.5 A IFSM non-repetitive peak forward current t = 10 ms half sine wave; Tj =Tj max prior to surge; VR =VRRMmax − 20 A |
Numéro de pièce similaire - BYD37J |
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Description similaire - BYD37J |
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