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TPA6111A2DG4 Fiches technique(PDF) 2 Page - Texas Instruments |
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TPA6111A2DG4 Fiches technique(HTML) 2 Page - Texas Instruments |
2 / 23 page www.ti.com ABSOLUTE MAXIMUM RATINGS DISSIPATION RATING TABLE TPA6111A2 SLOS313B – DECEMBER 2000 – REVISED JUNE 2004 These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. AVAILABLE OPTIONS PACKAGED DEVICES MSOP TA SMALL OUTLINE(1) MSOP(1) SYMBOLIZATION (D) (DGN) –40 °C to 85°C TPA6111A2D TPA6111A2DGN TI AJA (1) The D and DGN package is available in left-ended tape and reel only (e.g., TPA6111A2DR, TPA6111A2DGNR). Terminal Functions TERMINAL I/O DESCRIPTION NAME NO. BYPASS 3 I Tap to voltage divider for internal mid-supply bias supply. Connect to a 0.1-µF to 1-µF low ESR capacitor for best performance. GND 4 I GND is the ground connection. IN1– 2 I IN1– is the inverting input for channel 1. IN2– 6 I IN2– is the inverting input for channel 2. SHUTDOWN 5 I Puts the device in a low quiescent current mode when held high VDD 8 I VDD is the supply voltage terminal. VO1 1 O VO1 is the audio output for channel 1. VO2 7 O VO2 is the audio output for channel 2. over operating free-air temperature range (unless otherwise noted) (1) UNIT VDD Supply voltage 6 V VI Input voltage –0.3 V to VDD + 0.3 V Continuous total power dissipation internally limited TJ Operating junction temperature range –40 °C to 150°C Tstg Storage temperature range –65 °C to 150°C Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260 °C (1) Stresses beyond those listed under "absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. TA ≤ 25°C DERATING FACTOR TA = 70°C TA = 85°C PACKAGE POWER RATING ABOVE TA = 25°C POWER RATING POWER RATING D 725 mW 5.8 mW/ °C 464 mW 377 mW DGN 2.14 W(1) 17.1 mW/ °C 1.37 W 1.11 W (1) See the Texas Instruments document, PowerPAD Thermally Enhanced Package Application Report (literature number SLMA002), for more information on the PowerPAD package. The thermal data was measured on a PCB layout based on the information in the section entitled Texas Instruments Recommended Board for PowerPAD on page 33 of the before-mentioned document. 2 |
Numéro de pièce similaire - TPA6111A2DG4 |
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Description similaire - TPA6111A2DG4 |
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