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LM2694SDX Fiches technique(PDF) 5 Page - National Semiconductor (TI) |
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LM2694SDX Fiches technique(HTML) 5 Page - National Semiconductor (TI) |
5 / 19 page Electrical Characteristics Specifications with standard type are for T J = 25˚C only; limits in boldface type apply over the full Operating Junction Temperature (T J) range. Minimum and Maximum limits are guaranteed through test, design, or statistical correlation. Typical values represent the most likely parametric norm at T J = 25˚C, and are provided for reference purposes only. Unless otherwise stated the following conditions apply: V IN = 24V, RON = 200k Ω. See (Note 5). (Continued) Symbol Parameter Conditions Min Typ Max Units FB bias current 1 nA Thermal Shutdown T SD Thermal shutdown temperature 175 ˚C Thermal shutdown hysteresis 20 ˚C Thermal Resistance θ JA Junction to Ambient 0 LFPM Air Flow LLP Package 33 ˚C/W TSSOP Package 40 θ JC Junction to Case LLP Package 8.8 ˚C/W TSSOP Package 5.2 Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device is intended to be functional. For guaranteed specifications and test conditions, see the Electrical Characteristics. Note 2: The human body model is a 100pF capacitor discharged through a 1.5k Ω resistor into each pin. Note 3: VCC provides self bias for the internal gate drive and control circuits. Device thermal limitations limit external loading Note 4: For detailed information on soldering plastic TSSOP and LLP packages, refer to the Packaging Data Book available from National Semiconductor Corporation. Note 5: Typical specifications represent the most likely parametric norm at 25˚C operation. www.national.com 5 |
Numéro de pièce similaire - LM2694SDX |
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Description similaire - LM2694SDX |
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