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BC01BV-URT Fiches technique(PDF) 12 Page - List of Unclassifed Manufacturers

No de pièce BC01BV-URT
Description  Single Chip Bluetooth Device
Download  15 Pages
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Fabricant  ETC1 [List of Unclassifed Manufacturers]
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BC01BV-URT Fiches technique(HTML) 12 Page - List of Unclassifed Manufacturers

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bco1b-ds-003d
Product Data Sheet
Production Information
Figure 5: Re-flow solder profile 1
0
50
100
150
200
250
Time in minutes
24
Figure 6: Re-flow solder profile 2
0
50
100
150
200
250
Time in minutes
24
Figures 5 and 6 show the re-flow solder profile that was used to qualify the BlueCore01b packages.
This temperature profile was repeated three times during the qualification of the BlueCore01b packages with a
maximum temperature of 235°C.
Assembly Guidelines
Assembly Guidelines
Page 12 of 15
Whereas the above profile was used to confirm the reliablility of the BlueCore01b packages, the following
(figure 6) is the recommended solder profile to use when assembling BlueCore01b onto a circuit board.
Recommended Solder Profile
Initial Ramp: 60°C to 120°C/minute to 140°C to 150°C equilibrium 90°C to 120°C/minute ramp to 210°C to 220°C
maximum temperature. Time over liquidus should be 45 to 90 seconds. Rapid quenching provides superior
cosmetic appearance and bond strength.


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