MC10EL34 datasheet(5/8 Pages) ONSEMI

No de pièce	MC10EL34

Description	5V ECL 첨2, 첨4, 첨8 Clock Generation Chip

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Fabricant	ONSEMI [ON Semiconductor]

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MC10EL34, MC100EL34

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AC CHARACTERISTICS VCC= 5.0 V; VEE= 0.0 V or VCC= 0.0 V; VEE= –5.0 V (Note 1.)

–40

°C

25

°C

85

°C

Symbol

Characteristic

Min

Typ

Max

Min

Typ

Max

Min

Typ

Max

Unit

fmax

Maximum Toggle Frequency

TBD

GHz

tPLH

tPHL

Propagation

CLK to Q0

Delay to

CLK to Q1,2

Output

MR to Q

960

900

750

1200

1140

1060

960

900

750

1200

1140

1060

970

910

790

1210

1150

1090

ps

tSKEW

Within-Device Skew (Note 2.)

100

ps

tJITTER

Cycle–to–Cycle Jitter

TBD

ps

tS

Setup Time EN

400

ps

tH

Hold Time EN

250

ps

tRR

Set/Reset Recovery

400

200

400

200

400

200

ps

VPP

Input Swing (Note 3.)

150

1000

150

1000

150

1000

mV

tr

tf

Output Rise/Fall Times Q

(20% – 80%)

275

525

275

525

275

525

ps

1. 10 Series: VEE can vary +0.06 V / –0.5 V.

100 Series: VEE can vary +0.8 V / –0.5 V.

2. Within-device skew is defined as identical transitions on similar paths through a device.

3. VPP(min) is minimum input swing for which AC parameters guaranteed. The device has a DC gain of ≈40.

Figure 1. Timing Diagram

CLK

Q0

Q1

Q2

EN

The EN signal will freeze the internal clocks to the flip–flops on the first falling edge of CLK after its assertion. The internal

dividers will maintain their state during the internal clock freeze and will return to clocking once the internal clocks are unfrozen.

The outputs will transition to their next states in the same manner, time and relationship as they would have had the EN signal

not been asserted.

Internal Clock

Disabled

Internal Clock

Enabled

RESET

tRR

Numéro de pièce similaire - MC10EL34

Fabricant	No de pièce	Fiches technique	Description
ON Semiconductor	MC10EL34	94Kb / 3P	첨2,첨4,첨8 Clock Generation Chip 1996 REV 2
	MC10EL34	133Kb / 8P	5V ECL 첨2, 첨4, 첨8 Clock Generation Chip November, 2006 ??Rev. 10
	MC10EL34	173Kb / 9P	Clock Generation Chip July, 2016 ??Rev. 11
	MC10EL34D	94Kb / 3P	첨2,첨4,첨8 Clock Generation Chip 1996 REV 2
	MC10EL34D	133Kb / 8P	5V ECL 첨2, 첨4, 첨8 Clock Generation Chip November, 2006 ??Rev. 10

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Description similaire - MC10EL34

Fabricant	No de pièce	Fiches technique	Description
ON Semiconductor	MC10EL34	133Kb / 8P	5V ECL 첨2, 첨4, 첨8 Clock Generation Chip November, 2006 ??Rev. 10
	MC100LVEL34	145Kb / 10P	3.3V ECL 첨2, 첨4, 첨8 Clock Generation Chip November, 2006 ??Rev. 2
	MC100LVEL34	145Kb / 10P	3.3V ECL 첨2, 첨4, 첨8 Clock Generation Chip November, 2006 ??Rev. 2
Micrel Semiconductor	SY10EL34	57Kb / 4P	5V/3.3V 첨2, 첨4, 첨8 CLOCK GENERATION CHIP
Microchip Technology	SY100EL34	752Kb / 14P	5V/3.3V 첨2, 첨4, 첨8 Clock Generation Chip 02/28/20
Micrel Semiconductor	SY10EL34	61Kb / 5P	5V/3.3V 첨2, 첨4, 첨8 CLOCK GENERATION CHIP
Micrel Semiconductor	SY10EL34	176Kb / 7P	5V/3.3V 첨2, 첨4, 첨8 Clock Generation Chip
ON Semiconductor	MC10EL34	94Kb / 3P	첨2,첨4,첨8 Clock Generation Chip 1996 REV 2
	MC100LVEP34	150Kb / 12P	2.5V / 3.3V ECL 첨2, 첨4, 첨8 Clock Generation Chip November, 2006 ??Rev. 9
	MC100EL38	122Kb / 7P	5V ECL 첨2, 첨4/6 Clock Generation Chip October, 2006 ??Rev. 7

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MC10EL34 Fiches technique(PDF) 5 Page - ON Semiconductor

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