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TPA5051RSAR Fiches technique(PDF) 3 Page - Texas Instruments |
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TPA5051RSAR Fiches technique(HTML) 3 Page - Texas Instruments |
3 / 19 page www.ti.com FUNCTIONAL BLOCK DIAGRAM DATA1 BCLK1 LRCLK1 INPUT BUFFER OUTPUT BUFFER DATA_OUT1 CONTROL 2 3 I C 2 ADDx(2:0) DELAY MEMORY DELAY MEMORY DATA2 BCLK2 LRCLK2 DATA_OUT2 ABSOLUTE MAXIMUM RATINGS DISSIPATION RATINGS (1) RECOMMENDED OPERATING CONDITIONS TPA5051 SLOS497A – JUNE 2006 – REVISED JULY 2006 over operating free-air temperature (unless otherwise noted) (1) VALUE UNIT VDD Supply voltage –0.3 to 3.6 V VI Input voltage DATA, LRCLK, BCLK, SCL, SDA, ADD[2:0] –0.3 to 5.5 V Continuous total power dissipation See Dissipation Rating Table TA Operating free-air temperature range –40 to 85 °C TJ Operating junction temperature range –40 to 125 °C Tstg Storage temperature range –65 to 125 °C Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260 °C (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operations of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. PACKAGE TA≤ 25°C DERATING TA = 70°C TA = 85°C POWER RATING FACTOR POWER RATING POWER RATING RSA 2.5 W 25 mW/ °C 1.375 W 1.0 W (1) This data was taken using 1 oz trace copper and copper pad that is soldered directly to a JEDEC standard high-k PCB. The thermal pad must be soldered to a thermal land on the printed-circuit board. See TI technical briefs SCBA01D and SLUA271 for more information about using the QFN thermal pad. MIN MAX UNIT VDD Supply voltage VDD 3 3.6 V VIH High-level input voltage DATA1, DATA2, LRCLK1, LRCLK2, BCLK1, BCLK2, SCL, SDA, 2 V ADD[2:0] VIL Low-level input voltage DATA1, DATA2, LRCLK1, LRCLK2, BCLK1, BCLK2, SCL, SDA, 0.8 V ADD[2:0] TA Operating free-air temperature –40 85 °C 3 Submit Documentation Feedback |
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