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NCV51411 Fiches technique(PDF) 3 Page - ON Semiconductor

No de pièce NCV51411
Description  1.5 A, 260 kHz, Low Voltage Buck Regulator with Synchronization Capability
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Fabricant  ONSEMI [ON Semiconductor]
Site Internet  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

NCV51411 Fiches technique(HTML) 3 Page - ON Semiconductor

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NCV51411
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PACKAGE PIN DESCRIPTION
SO−8
SO−16
DFN−18
PIN SYMBOL
FUNCTION
1
15
1
BOOST
The BOOST pin provides additional drive voltage to the on−chip NPN power transist-
or. The resulting decrease in switch on voltage increases efficiency.
2
16
2, 3, 4
VIN
This pin is the main power input to the IC.
3
1
5, 6, 7
VSW
This is the connection to the emitter of the on−chip NPN power transistor and serves
as the switch output to the inductor. This pin may be subjected to negative voltages
during switch off−time. A catch diode is required to clamp the pin voltage in normal
operation. This node can stand −1.0 V for less than 50 ns during switch node flyback.
4
2
8
SHDNB
Shutdown_bar input. This is an active−low logical input, TTL compatible, with an in-
ternal pull−up current source. The IC goes into sleep mode, drawing less than 85 mA
when the pin voltage is pulled below 1.0 V. This pin may be left floating in applications
where a shutdown function is not required.
5
7
10
SYNC
This pin provides the synchronization input.
6
8
13
GND
Power return connection for the IC.
7
9
16
VFB
The FB pin provides input to the inverting input of the error amplifier. If VFB is lower
than 0.29 V, the oscillator frequency is divided by four, and current limit folds back to
about 1 ampere. These features protect the IC under severe overcurrent or short cir-
cuit conditions.
8
10
17
VC
The VC pin provides a connection point to the output of the error amplifier and input to
the PWM comparator. Driving of this pin should be avoided because on−chip test
circuitry becomes active whenever current exceeding 0.5 mA is forced into the IC.
3 − 6,
11 − 14
9, 11, 12,
14, 15, 18
NC
No Connection
SYNC
SHDNB
18
GND
VSW
VFB
VIN
VC
BOOST
PIN CONNECTIONS
1
16
VFB
GND
VC
SYNC
NC
NC
NC
NC
NC
NC
NC
NC
BOOST
SHDNB
VIN
VSW
1
2
3
4
5
6
7
8
9
18
17
16
15
14
13
12
11
10
BOOST
VIN
VIN
VIN
Vsw
VSW
VSW
SHDNB
NC
NC
VC
VFB
NC
NC
GND
NC
NC
SYNC
SO−8
SO−16W EP
18−Lead DFN
Note: DFN exposed pad may be soldered to a
heat spreader for enhanced thermal perform-
ance. The exposed pad may be connected to
GND; do not connect to any other potential.


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