ADN2880

Rev. 0 | Page 9 of 12

ASSEMBLY RECOMMENDATIONS

Coplanar PIN Photodiode for SDH/SONET

VCC

OUTB

OUT

VPD

Connected Through the FILTER Pin

FILTER

IN

B.W.

B.W.

B.W.

B.W.

0.85V

20pF

50

Ω

200

Ω

50

Ω

VCC

GND

GND

CAP

OUTB

OUT

RSSI

B.W

B.W.

B.W.

B.W.

B.W.

B.W.

B.W.

Figure 19. Equivalent Circuit of the Assembly Including Bond Wires

Dual Planar PIN/APD Photodiode for SDH/SONET

VCC

OUTB

OUT

PD

VPD

a Dual Planar PIN or APD

0.85V

20pF

50

Ω

200

Ω

50

Ω

IN

VCC

GND

GND

CAP

OUTB

OUT

RSSI

B.W

B.W.

B.W.

B.W.

B.W.

B.W.

B.W.

B.W.

B.W.

Figure 21. For Dual Planar PDs, No Connection to FILTER Pin

Table 4. Bill of Materials (BOM)

Component

Description

PD

1× vendor specific, 2.5 Gbps, photodiode

TIA

1× ADN2880 (0.7 mm × 1.2 mm), 3.2 Gbps,

transimpedance amplifier

1× 200 pF, RF single-layer capacitor

1× 560 pF, RF single-layer capacitor

1× 1000 pF, ceramic capacitor (optional for SDH)

Notes

One mil thickness, gold wire, ball bond recommended.

Minimize all GND bond-wire lengths.

Minimize IN, FILTER, OUT, and OUTB bond-wire lengths.

Maintain symmetry in length and orientation between OUT

and OUTB bond wires.

Maintain symmetry in length and orientation between IN and

FILTER bond wires.

Maintain symmetry between IN/FILTER and OUT/OUTB

bond wires.