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TPS732XX Fiches technique(PDF) 2 Page - Texas Instruments

No de pièce TPS732XX
Description  Cap-Free, NMOS, 250mA Low Dropout Regulator with Reverse Current Protection
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Fabricant  TI [Texas Instruments]
Site Internet  http://www.ti.com
Logo TI - Texas Instruments

TPS732XX Fiches technique(HTML) 2 Page - Texas Instruments

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ABSOLUTE MAXIMUM RATINGS
POWER DISSIPATION RATINGS
(1)
TPS732xx
SBVS037I – AUGUST 2003 – REVISED MAY 2006
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
ORDERING INFORMATION(1)
PRODUCT
VOUT(2)
TPS732xxyyyz
XX is nominal output voltage (for example, 25 = 2.5V, 01 = Adjustable(3)).
YYY is package designator.
Z is package quantity.
(1)
For the most current specification and package information, refer to the Package Option Addendum located at the end of this datasheet
or see the TI website at www.ti.com.
(2)
Output voltages from 1.2V to 4.5V in 50mV increments are available through the use of innovative factory EEPROM programming;
minimum order quantities may apply. Contact factory for details and availability.
(3)
For fixed 1.2V operation, tie FB to OUT.
over operating junction temperature range unless otherwise noted(1)
TPS732xx
UNIT
VIN range
–0.3 to 6.0
V
VEN range
–0.3 to 6.0
V
VOUT range
–0.3 to 5.5
V
VNR, VFB range
–0.3 to 6.0
V
Peak output current
Internally limited
Output short-circuit duration
Indefinite
Continuous total power dissipation
See Dissipation Ratings Table
Junction temperature range, TJ
–55 to +150
°C
Storage temperature range
–65 to +150
°C
ESD rating, HBM
2
kV
ESD rating, CDM
500
V
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under the Electrical Characteristics
is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability.
DERATING FACTOR
TA ≤ 25°C
TA = 70°C
TA = 85°C
BOARD
PACKAGE
RΘJC
RΘJA
ABOVE TA = 25°C
POWER RATING
POWER RATING
POWER RATING
Low-K(2)
DBV
64
°C/W
255
°C/W
3.9mW/
°C
390mW
215mW
155mW
High-K (3)
DBV
64
°C/W
180
°C/W
5.6mW/
°C
560mW
310mW
225mW
Low-K(2)
DCQ
15
°C/W
53
°C/W
18.9mW/
°C
1.89W
1.04W
0.76W
High-K(3)(4)
DRB
1.2
°C/W
40°C/W
25.0mW/
°C
2.50W
1.38W
1.0W
(1)
See Power Dissipation in the Applications section for more information related to thermal design.
(2)
The JEDEC Low-K (1s) board design used to derive this data was a 3 inch x 3 inch, two-layer board with 2-ounce copper traces on top
of the board.
(3)
The JEDEC High-K (2s2p) board design used to derive this data was a 3 inch x 3 inch, multilayer board with 1-ounce internal power and
ground planes and 2-ounce copper traces on the top and bottom of the board.
(4)
Based on preliminary thermal simulations.
2
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