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SC18IS600 Fiches technique(PDF) 22 Page - NXP Semiconductors

No de pièce SC18IS600
Description  SPI to IC-bus interface
Download  28 Pages
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Fabricant  PHILIPS [NXP Semiconductors]
Site Internet  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

SC18IS600 Fiches technique(HTML) 22 Page - NXP Semiconductors

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SC18IS600_601_3
© NXP B.V. 2006. All rights reserved.
Product data sheet
Rev. 03 — 13 December 2006
22 of 28
NXP Semiconductors
SC18IS600/601
SPI to I2C-bus interface
10. Package outline
Fig 27. Package outline SOT403-1 (TSSOP16)
UNIT
A1
A2
A3
bp
cD (1)
E (2)
(1)
eHE
LLp
QZ
y
w
v
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
0.15
0.05
0.95
0.80
0.30
0.19
0.2
0.1
5.1
4.9
4.5
4.3
0.65
6.6
6.2
0.4
0.3
0.40
0.06
8
0
o
o
0.13
0.1
0.2
1
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
0.75
0.50
SOT403-1
MO-153
99-12-27
03-02-18
w M
b p
D
Z
e
0.25
18
16
9
θ
A
A1
A2
L p
Q
detail X
L
(A )
3
HE
E
c
v M A
X
A
y
0
2.5
5 mm
scale
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm
SOT403-1
A
max.
1.1
pin 1 index


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