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AD8392AAREZ Fiches technique(PDF) 4 Page - Analog Devices |
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AD8392AAREZ Fiches technique(HTML) 4 Page - Analog Devices |
4 / 12 page AD8392A Rev. 0 | Page 4 of 12 ABSOLUTE MAXIMUM RATINGS Table 2. Parameter Rating Supply Voltage ±13 V (+26 V) Power Dissipation See Figure 3 Storage Temperature Range −65°C to +150°C Operating Temperature Range −40°C to +85°C Lead Temperature (Soldering 10 sec) 300°C Junction Temperature 150°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. THERMAL RESISTANCE θJA is specified for the worst-case conditions, that is, θJA is specified for the device soldered in the circuit board for surface-mount packages. Table 3. Package Type θJA Unit LFCSP-32 (CP) 27.27 °C/W TSSOP-28/EP (RE) 35.33 °C/W Maximum Power Dissipation The power dissipated in the package (PD) is the sum of the quiescent power dissipation and the power dissipated in the package due to the load drive for all outputs. The quiescent power is the voltage between the supply pins (VS) times the quiescent current (IS). Assuming that the load (RL) is midsupply, the total drive power is VS/2 × IOUT, some of which is dissipated in the package and some in the load (VOUT × IOUT). RMS output voltages should be considered. If RL is referenced to VS− as in single-supply operation, the total power is VS × IOUT. In single supply with RL to VS−, worst case is VOUT = VS/2. Airflow increases heat dissipation, effectively reducing θJA. In addition, more metal directly in contact with the package leads from metal traces, through holes, ground, and power planes reduces the θJA. Figure 3 shows the maximum safe power dissipation in the package vs. the ambient temperature for the LFCSP-32 and TSSOP-28/EP packages on a JEDEC standard 4-layer board. θJA values are approximations. 0 1 2 3 4 5 6 7 –40 –30 –20 –10 0 10 20 30 40 50 60 70 80 90 TEMPERATURE (°C) TJ = 150°C LFCSP-32 TSSOP-28/EP Figure 3. Maximum Power Dissipation vs. Temperature for a 4-Layer Board See the Thermal Considerations section for additional thermal design guidance. ESD CAUTION |
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