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BD137-16 Fiches technique(PDF) 5 Page - NXP Semiconductors |
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BD137-16 Fiches technique(HTML) 5 Page - NXP Semiconductors |
5 / 8 page 1999 Apr 12 5 Philips Semiconductors Product specification NPN power transistors BD135; BD137; BD139 PACKAGE OUTLINE UNIT bp cD E e1 LQ w REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ mm 0.88 0.65 2.7 2.3 0.60 0.45 11.1 10.5 7.8 7.2 2.29 e 4.58 0.254 P 3.2 3.0 P1 3.9 3.6 DIMENSIONS (mm are the original dimensions) Note 1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities. 16.5 15.3 1.5 0.9 L1(1) max 2.54 SOT32 TO-126 97-03-04 0 2.5 5 mm scale A Plastic single-ended leaded (through hole) package; mountable to heatsink, 1 mounting hole; 3 leads SOT32 D P1 P E e1 A L Q c bp 12 3 L1 w M e |
Numéro de pièce similaire - BD137-16 |
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Description similaire - BD137-16 |
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