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SMAJ17 Fiches technique(PDF) 5 Page - Taiwan Semiconductor Company, Ltd |
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SMAJ17 Fiches technique(HTML) 5 Page - Taiwan Semiconductor Company, Ltd |
5 / 5 page - 534 - This device is designed specifically for APPLICATION NOTES: transiient voltage suppression from threats generated by ESD for board levelload Recommended Pad Layout switching components. The pad dimensions should be 0.010" longer than the contact size in the lead axis. This allows a solder fillet The wide leads assure a large surface contact to form, see figure below. Contact factory for soldering for good heat disipation, and a low resistance methods. path for surge current flow to ground. This series is designed to optimize board space and for use with surface mount technology automated assembly equipment. They can be easily mounted on printed circuit boards and ceramic substrates to protect sensitive components from transient voltage damage. Dimensions in inches and (millimeters) |
Numéro de pièce similaire - SMAJ17 |
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Description similaire - SMAJ17 |
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