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54F646FCX Fiches technique(PDF) 8 Page - National Semiconductor (TI) |
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54F646FCX Fiches technique(HTML) 8 Page - National Semiconductor (TI) |
8 / 12 page ’F646B AC Electrical Characteristics 74F 54F 74F TA ea25 C TA VCC e Mil TA VCC e Com Symbol Parameter VCC ea50V CL e 50 pF CL e 50 pF Units CL e 50 pF Min Max Min Max Min Max fmax Maximum Clock Frequency 165 150 MHz tPLH Propagation Delay 25 70 25 80 ns tPHL Clock to Bus 30 75 30 80 tPLH Propagation Delay 20 60 20 70 ns tPHL Bus to Bus 20 60 20 70 tPLH Propagation Delay 25 75 25 85 ns tPHL SBA or SAB to A or B 25 75 25 85 tPZH Enable Time 25 65 25 80 ns tPZL OE to A or B 25 90 25 100 tPHZ Disable Time 15 65 15 75 ns tPLZ OE to A or B 20 70 20 85 tPZH Enable Time 20 70 20 85 ns tPZL DIR to A or B 30 95 30 100 tPHZ Disable Time 15 75 15 85 ns tPLZ DIR to A or B 25 85 25 95 ’F646B AC Operating Requirements 74F 54F 74F Symbol Parameter TA ea25 C TA VCC e Mil TA VCC e Com Units VCC ea50V Min Max Min Max Min Max ts(H) Setup Time HIGH or LOW 50 40 ns ts(L) Bus to Clock 50 40 th(H) Hold Time HIGH or LOW 15 15 ns th(L) Bus to Clock 15 15 tw(H) Clock Pulse Width 50 50 ns tw(L) HIGH or LOW 50 50 Ordering Information The device number is used to form part of a simplified purchasing code where the package type and temperature range are defined as follows 74F 646646B648 S C X Temperature Range Family Special Variations 74F e Commercial QB e Military grade device with 54F e Military environmental and burn-in processing Device Type X e Devices shipped in 13 reel Package Code Temperature Range SP e Slim Plastic DIP C e Commercial SD e Slim Ceramic DIP (0 Cto a70 C) S e Small Outline (SOIC) M e Military MSA e Shrink Small Outline SOIC EIAJ Type II (M646 only) (b55 Cto a125 C) L e Leadless Chip Carrier F e Flatpak 8 |
Numéro de pièce similaire - 54F646FCX |
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Description similaire - 54F646FCX |
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