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CS1301 Fiches technique(PDF) 8 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
No de pièce CS1301
Description  Media Coprocessor
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Fabricant  NSC [National Semiconductor (TI)]
Site Internet  http://www.national.com
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CS1301 Fiches technique(HTML) 8 Page - National Semiconductor (TI)

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Revision 2.2
2.0
Signal Definitions
This section defines the signals and describes the external
interface of the CS1301/CS1311 media companion. Figure
2-1 shows the signals organized by their functional groups.
The remaining subsections of this chapter describe:
• Section 2.1 "Ball Assignments": Provides a ball assign-
ment diagram and tables listing the signals sorted
according to ball number and alphabetically by signal
name.
• Section 2.2 "Signal Descriptions": Detailed descriptions
of each signal according to functional group.
• Section 2.3 "Reference Voltages": Discussion on ball
reference voltages.
2.1
BALL ASSIGNMENTS
The CS1301/CS1311 has a total of 169 functional pins,
excluding VDDQ,VSSQ, VREF_PCI, VREF_PERIPH, and
digital power/ground. For pins with 5.0V input capability,
the VREF_PCI or VREF_PERIPH determines 3.3V or 5.0V
input tolerance. Unused pins can remain floating/uncon-
nected; all pins that drive a clock should drive a series
resistor.
Table 2-1 shows the types of I/O circuits used by the
CS1301/CS1311 series. Note that the # symbol in a signal
name indicates that the active or asserted state occurs
when the signal is at a low voltage level. Otherwise, the
signal is asserted when at a high voltage level.
Figure 2-1. Functional Block Diagram
Table 2-1. Ball Type Descriptions
Modes
Description
I
Input only, except during boundary scan.
O
Output only, except during boundary scan.
OD
Open Drain output, active pull low, no active
drive high, requires external pull-up.
I/O
Input or Output.
I/OD
Input with Open Drain output, active pull low,
no active drive high, requires external pull-up.
MM_DQ [ 31: 00]
MM_CLK [ 1:0]
MM_RAS#
MM_CAS#
MM_WE#
MM_DQM [ 3:0]
MM_CS[ 3:0] #
VREF_PCI
VREF_PERIPH
Video Out*
VO_CLK
Memory
Interface
Interface
TRI_TIMER_CLK
TRI_USERIRQ
System
Interface
Geode™
CS1301/CS1311
TRI_CLKIN
MM_A [13:00]
JTAG_TCK
JTAG_TMS
JTAG_TDI
JTAG
VO_IO[2:1]
VO_DATA[07:00]
AO_OSCLK
AO_SCK
AO_WS
AO_SD[4:1]
SPDO
IIC-SDA
Audio Out
Interface
MM_CKE[1:0]
JTAG_TDO
IIC-SCL
TRI_RESET#
PCI_TRDY#
PCI_DEVSEL#
PCI_STOP#
PCI_AD [31: 00]
PCI_SERR#
PCI_CLK
PCI_GNT#
PCI_REQ#
PCI_IDSEL
PCI_FRAME#
PCI_IRDY#
PCI_INTD#
PCI_INTA#
PCI_INTB#
PCI_INTC#
PCI Bus
Interface
PCI_PAR
PCI_C/BE[3:0]#
PCI_PERR#
VI_CLK
VI_DVALID
VI_DATA[09:00]
Video In
*Video In and Audio In are supported by third party software solutions, not by the National Semiconductor solution.
Interface
AI_OSCLK
AI_SCK
AI_SD
AI_WS
Audio In*
Interface
S/PDIF
ACCESS.bus
BOOT_CLK
TESTMODE
SCANCPU
Test and
Measurement
Interface
Interface
Interface
VDDQ
VSSQ
(Total of 24) VDD
(Total of 40) VCC
(Total of 55) VSS
(Total of 8) NC
Power, Ground
and No
Connections
Interface


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