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Moteur de recherche de fiches techniques de composants électroniques |
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Moteur de recherche de fiches techniques de composants électroniques |
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SSM2302 Fiches technique(PDF) 13 Page - Analog Devices |
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SSM2302 Fiches technique(HTML) 13 Page - Analog Devices |
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13 / 20 page  SSM2302 Rev. 0 | Page 13 of 20 LAYOUT As output power continues to increase, care needs to be taken to lay out PCB traces and wires properly between the amplifier, load, and power supply. A good practice is to use short, wide PCB tracks to decrease voltage drops and minimize inductance. Make track widths at least 200 mil for every inch of track length for lowest DCR, and use 1 oz or 2 oz of copper PCB traces to further reduce IR drops and inductance. A poor layout increases voltage drops, consequently affecting efficiency. Use large traces for the power supply inputs and amplifier outputs to minimize losses due to parasitic trace resistance. Proper grounding guidelines helps to improve audio performance, minimize crosstalk between channels, and prevent switching noise from coupling into the audio signal. To maintain high output swing and high peak output power, the PCB traces that connect the output pins to the load and supply pins should be as wide as possible to maintain the minimum trace resistances. It is also recommended to use a large-area ground plane for minimum impedances. Good PCB layouts also isolate critical analog paths from sources of high interference. High frequency circuits (analog and digital) should be separated from low frequency ones. Properly designed multilayer printed circuit boards can reduce EMI emission and increase immunity to RF field by a factor of 10 or more compared with double-sided boards. A multilayer board allows a complete layer to be used for ground plane, whereas the ground plane side of a double- side board is often disrupted with signal crossover. If the system has separate analog and digital ground and power planes, the analog ground plane should be underneath the analog power plane, and, similarly, the digital ground plane should be underneath the digital power plane. There should be no overlap between analog and digital ground planes nor analog and digital power planes. INPUT CAPACITOR SELECTION The SSM2302 will not require input coupling capacitors if the input signal is biased from 1.0 V to VDD − 1.0 V. Input capacitors are required if the input signal is not biased within this recommended input dc common-mode voltage range, if high-pass filtering is needed (Figure 20), or if using a single- ended source (Figure 21). If high-pass filtering is needed at the input, the input capacitor along with the input resistor of the SSM2302 will form a high-pass filter whose corner frequency is determined by the following equation: fC = 1/(2π × RIN × CIN) Input capacitor can have very important effects on the circuit performance. Not using input capacitors degrades the output offset of the amplifier as well as the PSRR performance. PROPER POWER SUPPLY DECOUPLING To ensure high efficiency, low total harmonic distortion (THD), and high PSRR, proper power supply decoupling is necessary. Noise transients on the power supply lines are short-duration voltage spikes. Although the actual switching frequency can range from 10 kHz to 100 kHz, these spikes can contain frequency components that extend into the hundreds of megahertz. The power supply input needs to be decoupled with a good quality low ESL and low ESR capacitor—usually around 4.7 μF. This capacitor bypasses low frequency noises to the ground plane. For high frequency transients noises, use a 0.1 μF capacitor as close as possible to the VDD pin of the device. Placing the decoupling capacitor as close as possible to the SSM2302 helps maintain efficiency performance. |
Numéro de pièce similaire - SSM2302 |
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Description similaire - SSM2302 |
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