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1N5540DUR Fiches technique(PDF) 1 Page - Microsemi Corporation

No de pièce 1N5540DUR
Description  Low Voltage Surface Mount 500 mW Avalanche Diodes
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Fabricant  MICROSEMI [Microsemi Corporation]
Site Internet  http://www.microsemi.com
Logo MICROSEMI - Microsemi Corporation

1N5540DUR Fiches technique(HTML) 1 Page - Microsemi Corporation

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Low Voltage Surface Mount
500 mW Avalanche Diodes
SCOTTSD A L E DIVISION
1N5518BUR thru 1N5546BUR
(or MLL5518B thru MLL5546B)
DESCRIPTION
APPEARANCE
The 1N5518BUR thru 1N5546BUR series of 0.5 watt glass surface mount
Zener voltage regulators provides a selection from 3.3 to 33 volts in standard
5% tolerances as well as tighter tolerances identified by different suffix
letters on the part number.
These are also available with an internal-
metallurgical-bond option by adding a “-1” suffix (see separate data sheet)
including JAN, JANTX, and JANTXV military qualifications. Microsemi also
offers numerous other Zener products to meet higher and lower power
applications.
DO-213AA
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
FEATURES
APPLICATIONS / BENEFITS
• Surface mount equivalent to JEDEC registered
1N
5518 thru 1N5546 series
• Internally metallurgical bond option available by
adding “-1” suffix that also includes JAN, JANTX,
and JANTXV qualifications per MIL-PRF-19500/437
(see separate data sheet for same part numbers
with “-1” suffix
• DO-7 or DO-35 glass body axial-leaded Zener
equivalents also available per JEDEC registration
(see separate data sheets for part numbers 1N5518
thru 1N5546 DO-7 and DO-35
Regulates voltage over a broad operating current
and temperature range
Extensive selection from 3.3 to 33 V
Standard voltage tolerances are plus/minus 5% with
a “B” suffix, e.g. 1N5518BUR, etc.
Tight tolerances available in plus or minus 2% or 1%
with C or D suffix respectively, e.g. 1N5518CUR,
1N5518DUR, etc.
Hermetically sealed surface mount package
Nonsensitive to ESD per MIL-STD-750 Method 1020
Minimal capacitance (see Figure 3)
Inherently radiation hard as described in Microsemi
MicroNote 050
MAXIMUM RATINGS
MECHANICAL AND PACKAGING
• Operating and Storage temperature: -65ºC to
+175
ºC
• Thermal Resistance: 150 ºC/W junction to end cap
and 300
ºC/W junction to ambient when mounted on
FR4 PC board (1 oz Cu) with recommended footprint
(see last page)
• Steady-State Power: 0.5 watts at end cap
temperature TEC < 100
ºC or ambient temperature TA
< 25
ºC when mounted on FR4 PC board as
described for thermal resistance above (see Figure
2 for derating)
• Forward voltage @200 mA: 1.1 volts (maximum)
• Solder Temperatures: 260 ºC for 10 s (max)
CASE: Hermetically sealed glass DO-213AA
(SOD80 or MLL34) MELF style package
TERMINALS: End caps tin-lead plated solderable
per MIL-STD-750, method 2026
POLARITY: Cathode indicated by band where
diode is to be operated with the banded end positive
with respect to the opposite end for Zener regulation
MARKING: cathode band only
TAPE & REEL option: Standard per EIA-481-1-A
with 12 mm tape, 2000 per 7 inch reel or 5000 per
13 inch reel (add “TR” suffix to part number)
WEIGHT: 0.04 grams
See package dimensions and recommended pad
layout on last page
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 1
Copyright
 2003
10-13-2003 REV A


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