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UC1606XGAF Datasheet(Fiches technique) 4 Page - List of Unclassifed Manufacturers

Numéro de pièce UC1606XGAF
Description  65COM x 132SEG Matrix LCD Controller-Driver
Télécharger  46 Pages
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Fabricant  ETC1 [List of Unclassifed Manufacturers]
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UC1606XGAF Datasheet(HTML) 4 Page - List of Unclassifed Manufacturers

  UC1606XGAF Datenblatt HTML 1Page - List of Unclassifed Manufacturers UC1606XGAF Datenblatt HTML 2Page - List of Unclassifed Manufacturers UC1606XGAF Datenblatt HTML 3Page - List of Unclassifed Manufacturers UC1606XGAF Datasheet HTML 4Page - List of Unclassifed Manufacturers UC1606XGAF Datenblatt HTML 5Page - List of Unclassifed Manufacturers UC1606XGAF Datenblatt HTML 6Page - List of Unclassifed Manufacturers UC1606XGAF Datenblatt HTML 7Page - List of Unclassifed Manufacturers UC1606XGAF Datenblatt HTML 8Page - List of Unclassifed Manufacturers UC1606XGAF Datenblatt HTML 9Page - List of Unclassifed Manufacturers Next Button
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ULTRACHIP
High-Voltage Mixed-Signal IC
©1999-2003
2
Product Specifications
ORDERING INFORMATION
Product ID
Description
UC1606xGAF
65 COM x 132 SEG LCD driver
General Notes
APPLICATION INFORMATION
For improved readability, the specification contains many application data points. When application information is given, it
is advisory and does not form part of the specification for the device.
BARE DIE DISCLAIMER
All die are tested and are guaranteed to comply with all data sheet limits up to the point of wafer sawing for a period of
ninety (90) days from the date of UltraChip’s delivery. There is no post waffle saw/pack testing performed on individual die.
Although the latest modern processes are utilized for wafer sawing and die pick-&-place into waffle pack carriers,
UltraChip has no control of third party procedures in the handling, packing or assembly of the die. Accordingly, it is the
responsibility of the customer to test and quality their application in which the die is to be used. UltraChip assumes no
liability for device functionality or performance of the die or systems after handling, packing or assembly of the die.
LIFE SUPPORT APPLICATIONS
These devices are not designed for use in life support appliances, or systems where malfunction of these products can
reasonably be expected to result in personal injuries. Customer using or selling these products for use in such
applications do so at their own risk.


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